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PCB007 the real-time, online magazine for the Printed Circuit Board (PCB), Printed Circuit Board Assembly (PCBA), Electronics Manufacturing Services (EMS), Original Design Manufacturing (ODM) and PCB Design Industries.

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I-CONNECT007 encompasses the only real-time online magazines for the Printed Circuit Board (PCB), Electronics Manufacturing Services (EMS) and PCB Design industries. With over 22,000 articles published, I-CONNECT007 is the Electronics Packaging industry news leader.
 
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  • Upcoming IEEE/CPMT Chapter Meetings on High-Performance Cu Substrate, IC/Test Challenges, FEA Analysis and More
    The Santa Clara Valley Chapter of the Components, Packaging & Manufacturing Technology Society (CPMT/SCV, in conjunction with IEEE, announces three upcoming meetings for the electronics industry.
  • TÜVRheinland to Hold Seminar on Industrial Machinery Standards
    TÜVRheinland Explains ISO 13849-1, IEC 62061, and IEC 61508 at Full-Day Event in Boxborough, Mass on May 21st.
  • SMTA Plans to Keep the Industry Busy This Summer with Many Upcoming Opportunities
    The SMTA has announced several upcoming educational opportunities, Webinars and exhibitions for those in the electronics industry. Plan to be busy this summer!
  • iSuppli to Hold Webinar on China’s Electronics Design Market
    iSuppli Corp. will present a Webinar on China’s future in electronics design May 7, 2008 at 9PM EST.
  • Kyzen to Present at the Scandinavian Electronic Cleaning Seminar
    Kyzen announces that it will present during the Scandinavian Electronic Cleaning Seminar, scheduled to take place on May 21 and 22, 2008 at the Hotel Scandic Järva Krog in Stockholm, Sweden.
  • MEPTEC's 6th Annual MEMS Packaging Symposium Finalized
    MEPTEC has finalized its program for the 6th Annual MEMS Packaging symposium titled, “MEMS Market Evolution: From Technology Push to Market Pull,” on May 22, 2008.
  • Kyzen’s CTO to Present during 2008 SMTA Toronto Conference
    Kyzen announces that Mike Bixenman, its CTO, will present during the SMTA Toronto conference, May 13-16, 2008 at the Hilton Airport Hotel in Toronto, Canada.
  • 2008 IMPACT/EMAP: Abstract Due Date May 31, 2008
    The third IMPACT and 10th EMAP Joint Conference is held in conjunction with IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, ISU University, SMTA and TPCA.
  • SMTAI Conference Program Finalized
    Over one hundred leading edge suppliers will be featured in the first annual SMTAI Electronics Exhibition, held Tuesday and Wednesday, August 19 – 20, 2008. The exhibit floor is the perfect place to network and to see the industry’s latest technology.
  • IPC and Jisso International Sponsor Seminar on Implementing Advanced Interconnect Technology Solutions
    Hosted by the Georgia Institute of Technology, the event will provide information on the latest trends in interconnection technologies used in electronic products.
  • Inside the PCB Executive Management Meetings
    An interview with Bare Board Group (BBG) CEO Greg Papendrew reveals what topics were covered at the PCB Executive Management Meetings during the IPC Printed Circuits Expo, APEX and the Designers Summit 2008. The meetings, according to Papendrew, were a fantastic networking and learning opportunity for those in attendance—a way to find out what others are doing to be successful in the current market.
  • Learning & Discovery to Take Center Stage at NEW’s Live Production Lines
    Showcasing a diverse range of assembly, soldering and testing processes, the exhibit will run several times a day at Stand A80 and represents a unique learning environment for visitors and exhibitors alike.
  • Saturn Electronics to Host Lead-Free, Cost-Reductions Webinar
    Focusing on the implementation of necessary changes, the Webinar supplies immediate results by reducing lead-free costs via the use of recently introduced and proven materials and finishes.
  • International Symposium on Flexible Organic Electronics
    The first International Symposium on Flexible Organic Electronics (ISFOE) will take place in Halkidiki, Greece, on July 10-11, 2008.
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