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FLEX newsletter
Tuesday, May 13, 2008

This Week's Featured Story Flex News
  • BPA Report: Opportunities in Flex and Flex-Rigid Printed Circuits

  • BPA's 2008 Flex & Flex-Rigid Report will revisit the markets and opportunities for fabricators and materials suppliers for the next generation of flex and flex-rigid printed circuits.
     

    Joseph Fjelstad, author of Flexible Circuit Technology appreciates the feedback from you - the listeners - to his audio column.
    Do you have any questions about flexible circuit design, manufacture or assembly? PCB007's Joe Fjelstad wants to answer them.

    Click here
    to email Joe your question or suggestions for future audio column topics.


    CLICK HERE
    to listen to Joe's most recent Audio Column "Electronic Interconnection Files" (May 1, 2008)


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