This month's issue of SMT InDepth Focus is centered on the subject of cleaning materials & equipment. In Technical Solutions, discover the best practices for post reflow assembly cleaning and learn what the IPC and SMTA have in store for their cleaning & coating conference this week. New products from: Manncorp, Seika, Tyco and more. In the news: The global EMS market is projected to grow at an annual average rate of 12.2% through 2014; the 2011 IPC International Technology Roadmap for Electronic Interconnections is facing controversy; and more.

Best Practices for Post-Reflow Assembly Cleaning
Many manufacturers resist the idea of post-reflow cleaning because it flies in the face of the no-clean flux promise. Unfortunately, higher reflow temperatures, assembly and component miniaturization and increased reliability expectations have all eroded the basic principle of the promises of a no-clean process.

IPC and SMTA Cleaning, Coating Conference This Week
This comprehensive event will provide intense coverage of technological developments in all areas of cleaning and coating, applied to electronic assemblies. The focus is on addressing the most difficult problems associated with today’s challenges.

Material Witness: Thermal Oxidation of Materials, Part I
After working to determine the way oxidation affects PWB polymers, Chet Guiles offers a look at data that gives "interesting" observations. Guiles says, "I make no claim to having developed the Universal Theory of PWB Oxidation, but what we have found is both interesting and, I think, instructive."

Managing Dross in Soldering Processes
Wave, selective and related soldering processes involve large volumes of molten solder that are exposed to the atmosphere. Turbulence, oxygen exposure, temperature and other factors affect dross formation in wave soldering processes. Keith Sweatman and Keith Howell of Nihon Superior advise operators on how to reduce dross.

Manncorp Releases Trident III-ZD Defluxer/Evaporator
The Trident III automatic PCB cleaner by Manncorp has been made greener with the inclusion of a zero-discharge evaporator. Built to Trident's rugged specifications, the evaporator processes waste fluid continuously at the rate of 13 gallons per hour and converts it into a disposable substance.


Seika Machinery Introduces Nikko Power Cyclone
Seika Machinery, Inc., a provider of advanced machinery, materials and engineering services, releases NIX OF AMERICA's NIKKO POWER CYCLONE. The inline cyclone removes dust and particulates from PCB surfaces before solder application.

Zollner Milpitas Hosts Successful Grand Opening
Zollner Elektronik AG, and its USA division Zollner Electronics Inc., held a Grand Opening ceremony for its new Milpitas, California facility recently. Tours of the newly-constructed facility were given and demonstrations of the various products and technologies Zollner provides to its customers were conducted throughout the afternoon and evening.


A-Tek Systems Signs Distribution Agreement with Kolb
Patty Chonis, A-Tek's VP of Sales and Marketing, says, "Kolb is German engineering at its finest. We are very excited to be the distribution partner for Kolb. The technological features of the stencil and board cleaners, in conjunction with the cleaning detergents, will ensure that the customer will attain the high-quality results required for today's electronics manufacturing."

Kyzen Appoints Rotec as Exclusive Distributor for Benelux
According to Kyzen's Technical Manager, Serge Tuerlings, "Rotec has been a long-time, respected supplier of consumables to the electronics assembly industry and have built up a serious reputation as a reliable partner. We are convinced that, together with Rotec, we will be able to develop the Benelux market and improve our customer service levels in that region."

Using IPC 1750 Series For Life Cycle Analysis
PTC Product Management Director Jorgen Vos sits down with Guest Editor Krista Botsford at Electronics Midwest 2010 to discuss life cycle analysis (LCA) and how IPC's 1750 series of standards can be leveraged to support the gathering of LCA data.

EMS Industry On Track for 12.2% Annual Growth Through 2014
As the world's economies recover, the global EMS market is projected to grow at an annual average rate of 12.2% through 2014. IPC's own forecast of assembly market growth in North America projects a spike of 28% in 2010 as recovery takes hold, and a return to more normal growth of 12% in 2011.

2011 IPC Technology Roadmap Meets Controversy
With only five months left in its development, the 2011 IPC International Technology Roadmap for Electronic Interconnections is paving its way to being the most controversial roadmap to date. Several new topics and features incorporated into the roadmap provide users with revealing data and comparisons that will shake up the balance between technologies and reliability.