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SMT Week Newsletter - An I-Connect007 Publication
   2/3/2012       • home   • assembly   • cleaning   • design   • printing   • soldering   • test and inspection  




Technical Resources

RoHS Components

 



Events Calendar

Knowledge Base

 

 

 

 

     • Technical Solutions


Pogo-Style Spring Probes Reaching their Limits: High-Performance Requirements Drive New Solutions
The popularity of pogo pins has increased greatly over the years with the increase in device speeds and bandwidth requirements. The pins also have lower inductance for cleaner power delivery. The pins are capable of contacting arrayed packages and testing arrays of devices, as when testing devices on strips, on film-frames, or at wafer level.

Two Worlds Collide: Chipshooting & Die Bonding
Traditional wire bonding is changing to direct chip attach and packaging equipment now has to handle a wave of passives. While die bonders can place passive components, they cannot do this at the speed of traditional SMT chip-shooters. Performing this task with packaging equipment is far more costly, and placing micro-miniature components is still a real challenge.

Automotive Electronics Growing
The electronics content of an automobile presently represents approximately 30% of its value and this number is predicted to rise to 50% by 2020. Product liability is a major issue. Agilent Technologies' Global Account Manager, Stephan Boettger, explains the importance of functional test in proving the reliability of automotive electronics.

more articles


Manncorp MC-388 Pick & Place w/ 2 or Optional 4 Heads,
Placement Rate up to 10,000 cph & 256 Feeder Capacity

The answer for assemblers requiring just-in-time production of multiple boards in a single end product • Spacious1200 mm x 408 mm (47.25" x 16") work area • Capacity for 256 smart tape feeders in stand-alone configuration; 192 smart tape feeders in conveyor configuration • High-precision ball screw X-Y drive and closed-loop servo control system with linear encoding for 30um, 3 Sigma placement accuracy Incomparable value at $89,995.
Click here for more information.
 
     • Science & Technology


ORNL Microscopy: “Atomic Antenna” Behavior in Graphene
Atomic-level defects in graphene could be a path forward to smaller and faster electronic devices, according to a study led by researchers at the DoE's Oak Ridge National Laboratory. The study suggests that point defects, composed of silicon atoms that replace individual carbon atoms in graphene, could aid attempts to transfer data on an atomic scale by coupling light with electrons.

Scientists Create New Atomic X-Ray Laser
Lab scientists and international collaborators have created the shortest, purest X-ray laser pulses ever achieved, fulfilling a 45-year-old prediction and ultimately opening the door to new medicines, devices, and materials. The researchers aimed radiation at a cell containing neon gas, setting off an avalanche of X-ray emissions to create a new "atomic X-ray laser."

Terahertz Polarizer Nears Perfection
Researchers at Rice University are using carbon nanotubes as the critical component of a robust terahertz polarizer that could accelerate the development of new security and communication devices, sensors and non-invasive medical imaging systems, as well as fundamental studies of low-dimensional condensed matter systems.

more articles

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   • New Products


IPC APEX EXPO to Showcase Over 250 New Products
Representing advances in more than 100 product categories within the electronics manufacturing supply chain, more than 250 new products and services will debut at IPC APEX EXPO, February 28–March 1, 2012, at the San Diego Convention Center.

Essemtec FLX 2011 Adds Placing Force Measurement Option
New technologies, such as PoP component assembly or bare die assembly on COB applications, as well as the optimization of material consumption, demands increased knowledge of actual placement forces. For this purpose, Essemtec has developed a cost-efficient placing force measurement option for the FLX2011 series.

FlexLink Launches New Modular Wide Belt Conveyor
Everything in the wide belt conveyor, from the smallest component to horizontal plain bends and fully-functioning conveyor modules, is standardized for easy engineering, easy maintenance, and trouble-free operation. The modularity in design makes assembly and modifications easy and the system can be adapted to any requirement.


     • SMT Online News


IPC EMS Salary Survey Shows Cautious Upturn in Pay Hikes
IPC's biennial wage and salary survey for the EMS industry shows a cautious upturn in salary increases in 2011 compared to 2009. Reporting on data from 151 U.S. and Canadian EMS facilities, "IPC Wage Rate & Salary Study for the North American EMS Industry 2010-2011" is a valuable tool for EMS companies to gauge their position in competing for the best talent in the industry.

Celestica Posts Q4 Revenue of $7.2 Billion; Up 11%
"With a continued focus on operational effectiveness and revenue diversification, Celestica delivered solid revenue and earnings growth and strong return on invested capital in 2011, finishing the year with the best net cash position among our major North American competitors," said Craig Muhlhauser, President and CEO, Celestica.

SIA Lauds Obama's Commitment to Focus on Innovation
The SIA applauded President Obama's commitment to growing America's innovation economy, outlined in his State of the Union address. The SIA is particularly reassured by his attention to science and engineering education, basic research investments, high-skilled immigration reform, tax reform, and fair trade as a balanced approach to addressing the nation's short- and long-term goals.

OSI Systems Posts Record Q2 Revenue; Up 11% YoY
Deepak Chopra, OSI Systems' Chairman and CEO, stated, "We are very pleased to announce outstanding financial results for our second quarter. Our success was evident throughout all of OSI as each of our divisions reported both sales and earnings growth leading to record sales and earnings in our second quarter."

PartnerTech Appoints Knutsson EVP Operations
Anders Knutsson had been appointed Executive Vice President Operations for System Integration and Enclosures at PartnerTech. He will be heading the operational area of Systems Integration and Enclosures, including PartnerTechs’ sites in Åtvidaberg (Sweden), Moss (Norway), Vantaa (Finland) ,and Myslowice (Poland).

more news

 

 

  • home    • assembly    • cleaning    • design    • printing    • soldering    • test and inspection

Technical Editor - Pete Starkey
+44 (0) 1455 293333
pete@iconnect007.com

Director of Sales - Barb Hockaday
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Editorial Director - Ray Rasmussen
+1 916-294-7147
ray@iconnect007.com

SMT Editor - Holly Collins
+1 252-288-2751
holly@iconnect007.com


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