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Materials Matters

What happens when the lab meets fab? This column looks at how PCB materials and chemical processes work together. It also addresses current issues that OEMs must face when developing new products and looking for circuit solutions.

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Read the columns:

Metallization for Semi-Additive Processing, Part II: Processing of Next-Generation Build-Up Dielectric Materials
Metallization for Semi-Additive Processing of Build-Up Dielectric Materials, Part I: Process Development Overview
PWB Desmear Processing: Challenges and Solutions
Surface Finishes for Lead-Free Assembly
Cost Effective Electroplating
Optimum Design of Blind Via Technology
Full Build Electroless Copper for High Density Interconnection
It's Not Easy Being Greener
Electrolytic Copper Plating Technology for FPC Board Fabrication
Innerlayer Copper Reliability of Electroless Copper Processes
Why Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)?
Next Generation Electroplating Technology for Microvia Filling
Materials Matters: Solder Joint Reliability

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