Reid On Reliability by Paul Reid
| Paul Reid’s’ career in printed circuit board fabrication and reliability testing spans 29 years. Paul received a Bachelor in Science degree in 1975 and a Master in Science in 1980 from Rivier College, Nashua, New Hampshire. Paul has worked in Quality and Engineering in Managerial roles in New England and Canada. He has created technical animations of PCB fabrication, and recently, failure modes induced by thermal excursions in support of reliability testing. His animations have been used for education, technical reports and promotions internationally. Paul is a Program Coordinator at PWB Interconnect Solutions Inc., Ottawa, where his duties include reliability testing, failure analysis material analysis and PWB reliability consulting. He is currently investigating the reliability of microvias in military and lead/free applications and refining a test method Cyclic Time to Degradation (cT260). Contact Columnist |
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