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The E.I. Files by Joe Fjelstad
http://www.pcb007.com/radio/joe.htm

Verdant Electronics founder and president, Joseph (Joe) Fjelstad, is a four decade veteran of the electronics industry and an international authority and innovator in the field of electronic interconnection and packaging technologies with more than 250 U.S. and international patents issued or pending. He is also the author of Flexible Circuit Technology and author, co-author or editor of several other books and more than 300 technical papers, articles and columns. You may contact him by e-mail.

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Read the columns:

  • Future of Electronics Design and Manufacture Found in Past?
  • Printed Electronics: Remembrance of Things Past
  • EI Files Design Issue: Rethinking The 80% Rule
  • The EI Files: Knowledge is Key to Flex
  • The EI Files: New Stiffeners Offer More Than Support
  • The EI Files: Change is Often Slow, But Inevitable
  • A Review of Happy Holden's HDI Handbook
  • EI Files: The Subtle Benefits of Miniaturization
  • Photovoltaics and TSV Hot Topics at MAP 2008
  • Wanted: New ESD Protection for IC Devices
  • Research and Innovation Thrive At CERN
  • Cleanliness Makes a Difference in Manufacturing Interconnections
  • The EI Files: The Past a Great Guide to the Future
  • The EI Files: A Positive Side to REACH?
  • The EI Files: Warming Up to Thermal Management
  • The EI Files: The Interconnect Conversation Concludes
  • The Interconnect Conversation, Part 4
  • Interconnect Technology Enters the Third Dimension


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