Kyocera Tycom Corporation, formerly one-third owner, is pleased to announce that Tycom Canada, Ltd. is now a wholly owned subsidiary of Kyocera Tycom Corporation.

"By leveraging our years of experience in the printed circuit board label market, we are able to use our coated polyimide film that has established success in the surface mount and reflow process" notes Tom Rogers, Marketing Director at Polyonics.

Net Sales Improve 9.5% Year Over Year; MDI Awarded Custom Sensor for Measurement of Linear Position

Atotech will present "Potential Low-Cost Palladium-Alternatives for Activating Electroless Copper Deposition" during this year's show.

BAE Systems has been approved to provide engineering and technical services to the U.S. Army and other federal customers under a $16.4 billion government-wide contract called Rapid Response - 3rd Generation (R2-3G).

The Lockheed Martin team developing GeoEye's next-generation, high-resolution commercial Earth-imaging satellite system known as GeoEye-2, has successfully completed on-schedule a System Requirements Review (SRR), an important program milestone that precedes the Preliminary Design Review.

Lockheed Martin achieved a major milestone in the Joint and Allied Threat Awareness System (JATAS) Technology Demonstration program by delivering three prototype systems to the U.S. Navy for testing.

LDK Solar Co., Ltd., a leading manufacturer of multicrystalline solar wafers and PV products, today announced that it has expanded its vertical manufacturing by successfully completing the installation and trial runs of the first production line of solar cells in its newly installed manufacturing facility in Xinyu City.

Rising concerns about the need to reduce CO2 emissions and increase the use of renewable energy sources worldwide will stimulate the global photovoltaic market.

EMRISE Chairman and Chief Executive Officer Carmine T. Oliva said closing these transactions is the final step in the Company's strategy to divest non-core, non-performing and other businesses, significantly reduce its debt, strengthen its balance sheet and return to focusing on growing the business and enhancing stockholder value.

Enthone Inc., a business of Cookson Electronics, has introduced ENTEK® OM. The patented, Organic Metal® process delivers a visible, highly conductive PWB final finish that offers both ease of inspection and in-circuit testing (ICT).

We live in a service-driven society. It's a big market out there, and we can accept or reject products or services as we see fit. So, it's really darn important for a company selling a product or service to provide customer service at a standard that meets (or exceeds) the consumer's expectations.

Enthone's research has focused on providing a solderable surface finish for PCBs containing organic nanometal. The first universal nanofinish was proposed four years ago. Now, the new-generation nanofinish with organic metal-Ag complex performs as well as any other surface finish with regard to aging resistance, discoloration and solderability.

Global sales of semiconductors grew to $25.2 billion in July, an increase of 1.2% from June when sales were $24.9 billion and an increase of 37% from July 2009 when sales were $18.4 billion, the SIA reported. Year-to-date sales total $169.2 billion, an increase of 46.7% from the $115.3 billion reported for the first seven months of 2009.

IPC has announced the July findings from its monthly North American PCB Statistical Program. Rigid PCB shipments were up 23.9% while bookings increased 34.4% in July 2010 from July 2009. Flexible circuit shipments in July 2010 were up 38.2%, and bookings were up 28.8% compared to July 2009.

Compared to the previous year, the PCB Division increased its net proceeds during the period by 27.3% to CHF 17.8 million (first half of 2009: CHF 14.0 million); During the period, the ES Division achieved net proceeds of CHF 44.8 million (first half of 2009: CHF 41.5 million).

Is North America falling behind the rest of the world in HDI technology development? Not if Dan Smith can help it. "The New Mr. HDI" is putting together the first IPC HDI certification course and exam. We caught up with him and discussed the HDI course, what it takes to be an instructor and Happy Holden's 400-gig "data dump."

Authors from Sandia National Laboratories investigate the solderability of current immersion Ag technology after exposure to conditions that simulate long-term storage followed by bake out environments prior to actual reflow assembly.

Roy Porat, who has been with Camtek since 2001 serving in various positions in the United States and Asia, and for the past two years as General Manager of the company, is to succeed Rafi Amit as CEO. Amit will become Active Chairman of the Board of Directors.

Die thickness of common, high-volume chip stacks range from 50 to 100 um while thinning industry aims for ultra-thin chips of 10 um thickness, or less. For the first time, the required interconnect length between vertically arranged adjacent chip layers has reached dimensions that can be reasonably realized by anisotropic conductive adhesives layers (ACA).

We live in a service-driven society. It's a big market out there, and we can accept or reject products or services as we see fit. So, it's really darn important for a company selling a product or service to provide customer service at a standard that meets (or exceeds) the consumer's expectations.

This week, Dan Beaulieu asks: "Are you spending enough time thinking about your business?" Listen to his newest column and find out what needs to be done to keep your business booming. After all, thinking may be the most important element of your job.

Designing differential pairs is challenging enough, and the "alphabet soup" of high-speed serial links such as SATA, SAS and XAUI create more problems as you move from 1 Gbps to 10 Gbps and beyond. Eric Bogatin discusses some of the cutting-edge design techniques he'll be teaching at his "Differential Pair Boot Camp" in Santa Clara on October 4.

Is North America falling behind the rest of the world in HDI technology development? Not if Dan Smith can help it. "The New Mr. HDI" is putting together the first IPC HDI certification course and exam. We caught up with him and discussed the HDI course, what it takes to be an instructor and Happy Holden's 400-gig "data dump."

Authors from Sandia National Laboratories investigate the solderability of current immersion Ag technology after exposure to conditions that simulate long-term storage followed by bake out environments prior to actual reflow assembly.

What is "rheology" and why does "everything flow?" Chet Guiles examines the science of rheology and how understanding the rheology of the prepregs you use, during the time they melt and flow, can help a process engineer manage and control the lamination process.

"Life would be so good without those damn customers!" How many times have you heard that sentiment before? This week, Dan Beaulieu explains how to give your customer what they want to ensure your success.

Flexible circuit cables offer some significant advantages for facilitating the movement of data between elements of a system that must also be moved or flexed. However, there is a balancing act involved and there is more than one master to be served to create a system that is robust, reliable and easily manufacturable.

In "Zen and the Art of Motorcycle Maintenance," Robert M. Prisig contrasts his regular and ongoing daily approach to motorcycle maintenance with his friend's alternate view of leaving well enough alone between service center-based maintenance. What has this got to do with accurate impedance measurement, you may ask? Read on!

If a customer asks you to build a PCB that can withstand 20,000 volts, would you know how to build such a board? First things first: You cannot just say, "Well, I think FR-4 will work." It won't, and the board will fail. Boom! Here's how to avoid arc-overs, coronas and, most importantly, any booms.

We live in a service-driven society. It's a big market out there, and we can accept or reject products or services as we see fit. So, it's really darn important for a company selling a product or service to provide customer service at a standard that meets (or exceeds) the consumer's expectations.

This week, Dan Beaulieu asks: "Are you spending enough time thinking about your business?" Listen to his newest column and find out what needs to be done to keep your business booming. After all, thinking may be the most important element of your job.

Designing differential pairs is challenging enough, and the "alphabet soup" of high-speed serial links such as SATA, SAS and XAUI create more problems as you move from 1 Gbps to 10 Gbps and beyond. Eric Bogatin discusses some of the cutting-edge design techniques he'll be teaching at his "Differential Pair Boot Camp" in Santa Clara on October 4.

Is North America falling behind the rest of the world in HDI technology development? Not if Dan Smith can help it. "The New Mr. HDI" is putting together the first IPC HDI certification course and exam. We caught up with him and discussed the HDI course, what it takes to be an instructor and Happy Holden's 400-gig "data dump."

What is "rheology" and why does "everything flow?" Chet Guiles examines the science of rheology and how understanding the rheology of the prepregs you use, during the time they melt and flow, can help a process engineer manage and control the lamination process.

"Life would be so good without those damn customers!" How many times have you heard that sentiment before? This week, Dan Beaulieu explains how to give your customer what they want to ensure your success.

Flexible circuit cables offer some significant advantages for facilitating the movement of data between elements of a system that must also be moved or flexed. However, there is a balancing act involved and there is more than one master to be served to create a system that is robust, reliable and easily manufacturable.

In "Zen and the Art of Motorcycle Maintenance," Robert M. Prisig contrasts his regular and ongoing daily approach to motorcycle maintenance with his friend's alternate view of leaving well enough alone between service center-based maintenance. What has this got to do with accurate impedance measurement, you may ask? Read on!

If a customer asks you to build a PCB that can withstand 20,000 volts, would you know how to build such a board? First things first: You cannot just say, "Well, I think FR-4 will work." It won't, and the board will fail. Boom! Here's how to avoid arc-overs, coronas and, most importantly, any booms.

Interconnect separation is usually expressed as a crack that propagates at the internal interconnection. This failure mode produces a crack that is wedge-shaped, with the large end on the side of the foil closest to the middle of the PWB. An interconnect failure frequently develops slowly over time, accumulating damage at a constant rate after onset.