Low recycling rates for used TVs, PCs, and other electronics result in the loss of valuable resources, and electronic waste exports risk harming human health and the environment in countries that lack safe recycling and disposal capacity.

Chinese government policies intended to promote the adoption of green technologies are having the desired effect, with the country enjoying a boom in wind power capacity and PV installations that is fueling the establishment of a new generation of global green energy suppliers.

To help executives understand new industry paradigms and manage change, industry leaders and experts will come together at the Electronics Industry Executive Summit: Ideas for a Bright Future in the New Electronics Industry, October 13-14, 2010,

Driven by strong IC market expansion and growth in emerging markets, SEMICON Taiwan 2010 returns to the Taipei World Trade Center September 8-10, 2010 with eight technology theme pavilions focusing on LEDs, MEMS, 3-D ICs and Advanced Packaging/Testing, Green Management, Compound Semiconductors, CMP, AOI and the Secondary Market for capital equipment.

iNEMI releases brief updates on its key environmental projects: Studies on Halogenated Flame Retardant Alternatives, Eco-Impact Evaluator Project, PVC Alternatives for Desktop Power Cords, 2011 ECE Roadmap and iNEMI's Future Environmental Priorities.

Rockwell Collins, as member of a consortium of industry partners led by the Swedish Air Navigation Service Provider "Luftfartsverket" (LFV), has been awarded an active role in the AIRE "Green Connections" project.

Working together to address the latest round of proposed substance restrictions, IPC and the IPCA have submitted comments in response to the Indian Government's Ministry of Environment and Forests draft notification of E-waste (Management and Handling) Rules 2010.

The IPC's Electronics Industry Executive Summit will cover the latest trends in markets, technologies and management issues that will help executives change with the industry.

In this paper, the authors report results from a study on incorporating pre-formed toughening materials into high-crosslink density phenolic cured resin formulations and the effect of the toughener on thermomechanical properties, toughness and drillability of the electrical laminates.

IPC urges industry members to get involved in the ballot for IEEE standards on environmentally preferable electronic equipment. The impact of these IEEE standards on the electronics industry will set virtual standards for "environmental" electronics throughout the supply chain.

This paper examines the thermal properties of various halogen-free laminates used in handheld electronic products and correlates these properties with manufacturing requirements. Thermal properties investigated include z-axis CTE, time to delamination at 260°C and 288°C and temperature to decomposition.

Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!

In this paper, the authors report results from a study on incorporating pre-formed toughening materials into high-crosslink density phenolic cured resin formulations and the effect of the toughener on thermomechanical properties, toughness and drillability of the electrical laminates.

The new symposium will help attendees get up to speed on the latest regulatory developments from around the globe, including chemical regulations in Asia, changes to REACH and RoHS, implementation of system for labeling chemicals, the Canadian Chemicals Management Plan and California's Green Chemistry Initiative.

Feel as though you were right there, in the EIPC Conference audience, with the second part of European Editor Pete Starkey's in-depth review of the many presentations made during the two-day event, presented in conjunction with SMT/HYBRID/PACKAGING.

IPC is disappointed in the vote by the European Parliament's Environment Committee to include chemicals such as organobromines. While an outright ban of these chemicals has been averted, the committee's decision falls far short of supporting a rigorous scientific assessment that would ensure protection of the environment.

SurfEnergy, which aims to strengthen competitiveness by achieving the wide introduction of energy efficiency measures, was a main topic at a symposium organised by C-Tech Innovation in cooperation with the Institute of Metal Finishing last week in Birmingham, UK. Our European Editor, Pete Starkey, fills our readers in on what took place.

Bill Bader, iNEMI CEO, sat down with Editor Ray Rasmussen at last month's APEX to discuss the many initiatives his organization working on in packaging, energy, roadmaps and the environment--including a new effort on carbon footprinting.

Minsu (Tim) Lee Ph.D., Senior Researcher at Doosan Electro-Materials, discusses his company's long history with halogen-free materials. Doosan provides highly-reliable and environmentally-friendly substrate material for IC packages.

Dan Feinberg interviews his replacement as Chair of IPC's Government Relations Committee, DDi Corporation's Mikel Williams. Williams admits he's got some big shoes to fill, but is excited to support IPC in Washington D.C., especially as the organization works with the DoD and investigates "green" movements.

This paper examines the thermal properties of various halogen-free laminates used in handheld electronic products and correlates these properties with manufacturing requirements. Thermal properties investigated include z-axis CTE, time to delamination at 260°C and 288°C and temperature to decomposition.

Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!

In this paper, the authors report results from a study on incorporating pre-formed toughening materials into high-crosslink density phenolic cured resin formulations and the effect of the toughener on thermomechanical properties, toughness and drillability of the electrical laminates.

Couldn't make it to the recent EIPC Conference in Nuremberg? No worries: Feel as though you were right there, in the audience, with our European Editor Pete Starkey's in-depth review of the many presentations made during the two-day event, presented in conjunction with SMT/HYBRID/PACKAGING.

SurfEnergy, which aims to strengthen competitiveness by achieving the wide introduction of energy efficiency measures, was a main topic at a symposium organised by C-Tech Innovation in cooperation with the Institute of Metal Finishing last week in Birmingham, UK. Our European Editor, Pete Starkey, fills our readers in on what took place.

Bill Bader, iNEMI CEO, sat down with Editor Ray Rasmussen at last month's APEX to discuss the many initiatives his organization working on in packaging, energy, roadmaps and the environment--including a new effort on carbon footprinting.

Minsu (Tim) Lee Ph.D., Senior Researcher at Doosan Electro-Materials, discusses his company's long history with halogen-free materials. Doosan provides highly-reliable and environmentally-friendly substrate material for IC packages.

Dan Feinberg interviews his replacement as Chair of IPC's Government Relations Committee, DDi Corporation's Mikel Williams. Williams admits he's got some big shoes to fill, but is excited to support IPC in Washington D.C., especially as the organization works with the DoD and investigates "green" movements.

One of the consequences of RoHS compliance and lead-free soldering is a marked increase in the use of ENIG as a solderable final finish. Understanding and managing the ENIG line will produce an ENIG deposit that is free of nickel corrosion or "Black Pad."

Many companies can still use lead solder parts, but they face growing challenges as supplies dwindle. Military, medical, instrumentation and monitoring, and aerospace were never covered by RoHS, but it's nearly impossible to get passives and many other components in lead-based formats.

Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!

Feel as though you were right there, in the EIPC Conference audience, with the second part of European Editor Pete Starkey's in-depth review of the many presentations made during the two-day event, presented in conjunction with SMT/HYBRID/PACKAGING.

Couldn't make it to the recent EIPC Conference in Nuremberg? No worries: Feel as though you were right there, in the audience, with our European Editor Pete Starkey's in-depth review of the many presentations made during the two-day event, presented in conjunction with SMT/HYBRID/PACKAGING.

SurfEnergy, which aims to strengthen competitiveness by achieving the wide introduction of energy efficiency measures, was a main topic at a symposium organised by C-Tech Innovation in cooperation with the Institute of Metal Finishing last week in Birmingham, UK. Our European Editor, Pete Starkey, fills our readers in on what took place.

The North American PCB industry is stronger--in spite of appearances to the contrary. Industry strength will help secure its place in the next chapter. The challenge will be to survive the winding down of Moore's Law on silicon while other materials and processes emerge to make possible future electronics advancements.

ICT welcomed delegates last week to the UK's Devonport Hotel for the first Darlington Seminar of 2010, which included presentations from Lamar Group, Park Electrochemical, Electronics Yorkshire and IeMRC. I-Connect007's European Editor Pete Starkey was there and gives a full report.

Many new material and circuit manufacturers made a showing this year. Their booths were not very large, but they did a great job in promoting specialty items.

The list of replacements for eutectic tin-lead keeps growing, and now, over three years after implementation of the lead-free mandate, new alloys are still being developed. How do you cut through the clutter and find the right alloy?

As 2010 approaches, I-Connect007's European Editor, Pete Starkey, decided to take a look back at the year's top technical articles--compiling a list of the most popular articles across the site.

"Cool" is no longer about how fast a car goes or how great it looks, but, rather, what it can do to keep you connected while you're getting there. Some will still choose the "vroom," but more and more will opt to spend money on the electronics over the engine.