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New Products| 54042 Records Searched | 239 Matches |
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 |  | New Silver Paste Introduced for N-Type Cells Monday, August 30, 2010 | Heraeus Heraeus has released SOL9383, specifically formulated for n-Type monocrystalline cells. This new silver paste is specially formulated and designed to make excellent contact on P+ surface of N-Type Cells.
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 |  | Rogers Features Circuit Solutions at Electronics Midwest Wednesday, August 25, 2010 | Rogers Corporation Rogers Corporation will be highlighting the benefits of its new 6.15 dielectric constant RO4360 laminate and RO4460 prepreg system at the upcoming Electronics Midwest 2010 exhibition.
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|  | DKN Concept: Ultra Thin Connectors on HD Flex Substrates Monday, August 16, 2010 | DKN Research DKN Research recently unveiled a new concept for Ultra Thin Connectors on high-density flexible substrates to showcase the connector's flexibility and optimize a package design process.
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 |  | Patented SG Hole Drilling Rosette Determines Residual Stresses Monday, August 02, 2010 | PRWeb Hole drilling rosettes with three SG measuring grids are normally used for the hole drilling method. The eccentricity of the hole is a possible source of error with this method. The new RY61M SG hole drilling rosette uses six measuring grids instead of the customary three, to further improve the accuracy of this process.
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 |  | Rogers Creates 6.15 Dk ML Laminate System Friday, July 23, 2010 | Rogers Corporation Rogers Corporation has developed the perfect match for their popular RO4360 laminate: RO4460 prepreg. Both materials feature dielectric constant of 6.15 ± 0.15 and low dielectric loss of 0.003 at 2.5 GHz.
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 |  | Fuwei Films Launches New Dry Film Product Thursday, July 22, 2010 | PRNewswire Fuwei Films (Holdings) Co. Limited, a manufacturer and distributor of high-quality BOPET plastic films located in China, today announced that its wholly owned subsidiary, Fuwei Films (Shandong) Co. Ltd., has successfully completed the development of a new dry film product.
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|  | Rogers Tackles Top Trends with High-Freq Laminate Monday, May 24, 2010 | Real Time With...IPC APEX Expo 2010  John Ritchie, Product Manager for Rogers Corporation, reviews his company's new high-frequency laminate product, RO4360, which features a Dk of 6.15. The new product can address issues concerning what Ritchie sees as three mega-trends in the industry: The drive toward mass transit, sustainable energy and Internet growth.
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|  | Printed Circuit Girls and Geeks Unite Monday, July 05, 2010 | Real Time With...IPC APEX Expo 2010  Marissa Oskarsen of E-Tec Sales, also known as the Printed Circuit Girl, discusses her latest initiative: Printed Circuit Girls and Geeks. She also explains new Web technologies that her company will be rolling out in the near future.
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 |  | Real Time with...IPC Produces Over 100 Videos Wednesday, April 14, 2010 | Real Time With...IPC APEX Expo 2010 I-Connect007's team of editors, guest editors, videographers and video editors worked throughout the show to capture the keynotes, the industry's top technologists and business leaders, bringing our readers and viewers the world's most comprehensive event coverage and content.
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|  | Direct Digital Imaging: A New Design Comes to Life Friday, January, 2010 | Real Time With...productronica 2009  Thomas Kunz, President of Schmoll Maschinen, introduces a new conceptual machine design dubbed Direct Digital Imaging (DDI)--a machine developed by Schmoll, in cooperation with Bacher, as an alternative to LDI.
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|  | Introducing a Unique Solder Mask Machine to the Asian Market Monday, December 21, 2009 | Real Time With...HKPCA & IPC Show 2009  Find out from Technical Director, Lionel Fullwood, how WKK's foray into equipment manufacture produced a machine that both lowers exposure time and enables higher-quality PCB production with its CCD components.
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 |  | EIPC Speednews: Productronica Review Thursday, November 19, 2009 | EIPC Visiting the circuit board section of productronica this year can be likened to visiting an old friend who has not been at all well.
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 |  | Orbotech Introduces LDI System for Solder Mask Applications Tuesday, November 10, 2009 | Orbotech Paragon-SM 20 is a high-accuracy, fast throughput LDI solution for imaging solder mask layers in QTA and sampling, as well as HDI and rigid-flex/flex applications. The system is on display at productronica 2009 in Munich, Germany.
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 |  | Dow Electronic Materials Launches Silveron MF 100 Thursday, September 10, 2009 | Business Wire Dow Electronic Materials introduces Silveron MF 100 autocatalytic silver and Aurolectroless SMT immersion gold for ASIG (autocatalytic silver immersion gold) final finish process for the PCB industry.
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|  | Rogers Tackles Top Trends with High-Freq Laminate Monday, May 24, 2010 | Real Time With...IPC APEX Expo 2010  John Ritchie, Product Manager for Rogers Corporation, reviews his company's new high-frequency laminate product, RO4360, which features a Dk of 6.15. The new product can address issues concerning what Ritchie sees as three mega-trends in the industry: The drive toward mass transit, sustainable energy and Internet growth.
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|  | Printed Circuit Girls and Geeks Unite Monday, July 05, 2010 | Real Time With...IPC APEX Expo 2010  Marissa Oskarsen of E-Tec Sales, also known as the Printed Circuit Girl, discusses her latest initiative: Printed Circuit Girls and Geeks. She also explains new Web technologies that her company will be rolling out in the near future.
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|  | Sun Chemical Introduces New Flex Circuit Solder Mask Monday, January 04, 2010 | Real Time With...productronica 2009  Sun Chemical's Tony Searle and Dr. Karl-Heinz Ognibeni discuss the company's newest solder mask formulated for flex and rigid-flex applications with Editor Steve Gold. Searle also gives his thoughts on the European solder mask market.
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|  | Direct Digital Imaging: A New Design Comes to Life Friday, January, 2010 | Real Time With...productronica 2009  Thomas Kunz, President of Schmoll Maschinen, introduces a new conceptual machine design dubbed Direct Digital Imaging (DDI)--a machine developed by Schmoll, in cooperation with Bacher, as an alternative to LDI.
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|  | Introducing a Unique Solder Mask Machine to the Asian Market Monday, December 21, 2009 | Real Time With...HKPCA & IPC Show 2009  Find out from Technical Director, Lionel Fullwood, how WKK's foray into equipment manufacture produced a machine that both lowers exposure time and enables higher-quality PCB production with its CCD components.
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|  | New Liquid Product Replaces Coverlay Foils for Flex Circuits Thursday, November 12, 2009 | Pete Starkey, I-Connect007 A highlight of the productronica Forum in Munich was the technical presentation of Sun Chemical's Dr. Karl-Heinz Ognibeni, who described the development and evaluation of the newly-announced SunFlex family of screen printable flexible circuit coverlay materials.
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|  | Sun Chemical Launches New Flex Solder Mask Thursday, November 12, 2009 | Real Time With...Productronica  Sun Chemical executives Tony Searle and Dr. Karl-Heinz Ognibeni discuss the company's newest solder mask formulated for flex and rigid-flex applications. Tony also discusses the European solder mask market.
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|  | Orbotech Launches Paragon SM20 at productronica Wednesday, November 11, 2009 | Pete Starkey, I-Connect007 Is LDI a solution for the needs of solder mask imaging? Uwe Altmann, Orbotech's LDI Product Manager, describes the Paragon SM20's versatility as a high-accuracy digital imaging solution for quick-turnaround and sampling, as well as HDI and rigid-flex--offering higher yields, superior image quality and lower costs.
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|  | Opening Eyes on Weave and CAF Wednesday, October 14, 2009 | Real Time With...IPC Midwest 2009  Typical glass fibers can present an uneven pattern to the copper traces overlaid upon them, and that can lead to signal skew and timing errors. John Kuhn of Dielectric Solutions discusses a new, tighter fiber weave that can help eliminate "fiber weave effect" and the attendant signal integrity problems.
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|  | New Liquid Product Replaces Coverlay Foils for Flex Circuits Thursday, November 12, 2009 | Pete Starkey, I-Connect007 A highlight of the productronica Forum in Munich was the technical presentation of Sun Chemical's Dr. Karl-Heinz Ognibeni, who described the development and evaluation of the newly-announced SunFlex family of screen printable flexible circuit coverlay materials.
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|  | Orbotech Launches Paragon SM20 at productronica Wednesday, November 11, 2009 | Pete Starkey, I-Connect007 Is LDI a solution for the needs of solder mask imaging? Uwe Altmann, Orbotech's LDI Product Manager, describes the Paragon SM20's versatility as a high-accuracy digital imaging solution for quick-turnaround and sampling, as well as HDI and rigid-flex--offering higher yields, superior image quality and lower costs.
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 |  | Bogatin: Sensor Motes the Next Killer App? Wednesday, June 24, 2009 | Eric Bogatin, Bogatin Enterprises Remote sensor nodes--used for energy harvesting and environmental monitoring--were the talk of the Sensor Expo in Chicago, Illinois. Will these motes fuel the next killer app for the electronics industry?
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|  | The Shaughnessy Report: DownStream Takes "Evil" Out Of Postprocessing Wednesday, May 13, 2009 | Andy Shaughnessy, Design007  As Downstream Technologies founder Rick Almeida explains, PCB designers often consider postprocessing to be a "necessary evil." But CAM350XL, a suite that encompasses DownStream's CAM350 and BluePrint tools, may change that.
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 |  | The Sales Cycle: Marketing Value with Valuable Tools Monday, March 23, 2009 | Barry Matties, The Sales Cycle The only sales being made today are ones where the seller provides unquestioned value to the customer. But how do savvy sellers make sure their value is known to new prospects? This week's column focuses on what marketing tools are working when selling value in more creative ways.
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 |  | EPTE Newsletter from Japan: NEPCON World 2009, Part III Friday, February 20, 2009 | Dominique Numakura, DKN Research Much of NEPCON World Japan focused on printed electronics technologies, with products and technology on display and a keynote speech by a nanotechnology professor. But the exhibition should have done a better job of highlighting printed electronics as a stand-alone technology.
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