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Printed Electronics

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NEWS    September 2, 2010
PAGE 1 of 61.     NEXT 10 RESULTS
 
NewPolyonics Offers High Temp Substrates for Printed Electronics
Thursday, September 02, 2010 | Polyonics    
"By leveraging our years of experience in the printed circuit board label market, we are able to use our coated polyimide film that has established success in the surface mount and reflow process" notes Tom Rogers, Marketing Director at Polyonics.
Researchers Break New Ground in Nanotechnology
Wednesday, September 01, 2010 | The Hong Kong Polytechnic University    
A pioneering study by researchers of The Hong Kong Polytechnic University (PolyU) has shown that sandwiching a simple layer of silver nanoparticles can significantly improve the performance of organic transistors which are commonly used in consumer electronics.
EIPC Speednews: News from the European PCB Market
Tuesday, August 17, 2010 | EIPC    
Printed electronics offers a wide range of opportunities that cannot be realised using conventional electronics manufacturing approaches and, as a result, there is a rapidly expanding global effort to both develop the technology and to bring to market new products covering a wide range of novel applications.
Real Time Locating and Wireless Sensor Networks
Thursday, August 12, 2010 | IDTechEx    
In the past, too much use of RFID has involved sensing items and conveyances only when they pass very near to the occasional interrogator. Heroic assumptions are then made about what happened in between.
Trial Kit Enables 50-micron High-density Thick-film Circuits
Tuesday, August 10, 2010 | DKN Research    
DKN Research is now offering a Fine Silver Conductor Trial Kit capable of producing fine lines down to 50 microns to companies interested in producing high density thick film circuits.
Teijin Enters Printed Electronics Market through NanoGram Acquisition
Monday, August 09, 2010 | Teijin Ltd    
As a wholly owned subsidiary of Teijin, NanoGram will pursue its interest in expanding into the development of silicon-based nanoparticles, working closely with the Teijin Group's Integrative Technology Research Institute.
Report: Opportunities Analysis for Printed Electronics
Friday, August 06, 2010 | Business Wire    
This report attempts to provide a candid view on the opportunities and challenges that exist in the industry today. Its objective is to help organizations decide which of the many opportunities they could focus on depending on their competences, skills and technology platforms.
Research and Markets: Opportunities Analysis for Printed Electronics 2009-2015
Friday, August 06, 2010 | Research and Markets    
This report attempts to provide a candid view on the opportunities and challenges that exist in the printed electronics industry today.
IPC Executive Conference Addresses Critical Issues
Wednesday, August 04, 2010 | IPC    
To help executives understand new industry paradigms and manage change, industry leaders and experts will come together at the Electronics Industry Executive Summit: Ideas for a Bright Future in the New Electronics Industry, October 13-14, 2010,
The Hot Sectors in Asian Printed Electronics
Friday, July 30, 2010 | Printed Electronics World    
There are about 3,000 organizations worldwide actively involved in the development of printed electronics. By number of organizations, Europe has the edge over the U.S., then comes Asia. However, this disguises the fact that those involved in Asia tend to be large conglomerates that can invest much more than those in the West.
FEATURES    September 2, 2010
PAGE 1 of 5.     NEXT 10 RESULTS
 
Printable Materials and Devices for Electronic Packaging
Tuesday, July 27, 2010 | Rabindra N. Das, How T. Lin, Jianzhuang Huang, John M. Lauffer, Frank D. Egitto, Mark D. Poliks and Voya R. Markovich, Endicott Interconnect Technologies, Inc.    
In this paper, the authors report novel printable materials with the potential to surpass conventional materials to produce fine structures compatible with organic substrates. Specifically, the electronic applications of printable materials are discussed, such as adhesives, inter-layer dielectrics, embedded passives and circuits.
The Next Stage of Assembly: 3-D and Solder-Free
Thursday, July 22, 2010 | Harvey Miller, Fabfile Online    
Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!
Paper or Plastic: How Would you Like Your Board?
Thursday, July 01, 2010 | Robert Tarzwell, DMR Ltd.    
Every now and then, a true technological breakthrough comes along. The paper circuit is just such a breakthrough. These new circuits--printed on standard photocopier paper--can be as complicated as fine-line 6-layer circuits, and they cost far less than traditional PCBs to build. But printing companies will have the jump on traditional PCB fabricators when it comes to paper circuits.
Speedstack with VMM: The Story Behind the Headline
Tuesday, June 15, 2010 | Pete Starkey, I-Connect007    
Polar's Speedstack system is in widespread use for documentation and design of impedance-controlled layer stack-up. The company has responded to demands to use the system without reference to libraries by releasing "Virtual Material Mode"--allowing designers and fabs the freedom to experiment with stack-ups and capture all impedance and layer allocation before they lock down the materials specification.
The Great Debate: Where's the Next China?
Thursday, March 04, 2010 | Ray Rasmussen, I-Connect007    
As the economy improves, companies are beginning to act on strategies and plans to position themselves in the geographic markets that make the most sense for the next decade.
Printed Electronic Circuit Process for LED Interconnection
Monday, January 18, 2010 | Mike DuBois, Caledon Controls Ltd.    
Using printed electronic ink products and processes to manufacture high-performance, thermally-conductive circuit boards offers clear advantages in manufacturing flexibility, performance and cost.
Does the "Sunset Industry" Describe a Global Phenomenon?
Thursday, January 14, 2010 | Harvey Miller, Fabfile Online    
Steam locomotives were replaced by diesels, vacuum tubes by transistors and incandescent lamps by HB-LEDs. Inefficient, high-labor cost, high-energy cost industries have always been candidates for replacement. Here's why.
Dr. Nakahara Takes on Printed Electronics
Tuesday, January 12, 2010 | Ray Rasmussen, PCB007    
Dr. Nakahara says, "Printing or screening conductive ink is not new. What I don't believe is that those proponents saying all PCBs will be replaced by printed electronics. Bullshit!"
Silver Bullet Process Merges PE and PCB Technologies
Monday, January 11, 2010 | Robert Tarzwell, DMR PCB    
Designed to replace a traditional PCBs using technologies from the printed electronics industry, the process uses approximately one-tenth of the traditional equipment for making a typical PCB.
Chinese Flex/PCB Industry Embraces PE
Thursday, January 07, 2010 | Joel Yocom, Conductive Inkjet Technology    
The Chinese government, three universities, the CPCA and local industry are coming together to develop PE concepts locally with the support, blessing and funding of the Chinese government.
ARTICLES    September 2, 2010
PAGE 1 of 9.     NEXT 10 RESULTS
 
Printable Materials and Devices for Electronic Packaging
Tuesday, July 27, 2010 | Rabindra N. Das, How T. Lin, Jianzhuang Huang, John M. Lauffer, Frank D. Egitto, Mark D. Poliks and Voya R. Markovich, Endicott Interconnect Technologies, Inc.    
In this paper, the authors report novel printable materials with the potential to surpass conventional materials to produce fine structures compatible with organic substrates. Specifically, the electronic applications of printable materials are discussed, such as adhesives, inter-layer dielectrics, embedded passives and circuits.
The Next Stage of Assembly: 3-D and Solder-Free
Thursday, July 22, 2010 | Harvey Miller, Fabfile Online    
Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!
EPTE Newsletter from Japan: JPCA Show 2010, Part VI
Monday, July 12, 2010 | Dominique K. Numakura, DKN Research    
JPCA exhibitors that featured printable electronics fell into three categories: Material suppliers, manufacturing equipment and tool vendors, and electronics circuit/device manufacturers. Most executives affiliated with JPCA agreed that printable electronics must be included in business plans going forward.
EPTE Newsletter from Japan: JPCA Show 2010, Part V
Monday, July 05, 2010 | Dominique K. Numakura, DKN Research    
Fine-line generation could be considered the main dish of a multi-course meal offered by the printed circuit industry. Japanese PCB manufacturers, especially flexible circuit manufacturers, are continuously competing internally with their fine-line generation capabilities.
Paper or Plastic: How Would you Like Your Board?
Thursday, July 01, 2010 | Robert Tarzwell, DMR Ltd.    
Every now and then, a true technological breakthrough comes along. The paper circuit is just such a breakthrough. These new circuits--printed on standard photocopier paper--can be as complicated as fine-line 6-layer circuits, and they cost far less than traditional PCBs to build. But printing companies will have the jump on traditional PCB fabricators when it comes to paper circuits.
EPTE Newsletter from Japan: JPCA Show 2010, Part IV
Monday, June 28, 2010 | Dominique K. Numakura, DKN Research    
Embedded components/circuit boards were one of the most popular technical topics talked about at the JPCA Show in several years. This year's show featured a special corner, called "Embedded Components Circuit Boards," where more than a dozen companies contributed by displaying samples and panels to promote their latest technologies.
Speedstack with VMM: The Story Behind the Headline
Tuesday, June 15, 2010 | Pete Starkey, I-Connect007    
Polar's Speedstack system is in widespread use for documentation and design of impedance-controlled layer stack-up. The company has responded to demands to use the system without reference to libraries by releasing "Virtual Material Mode"--allowing designers and fabs the freedom to experiment with stack-ups and capture all impedance and layer allocation before they lock down the materials specification.
EPTE Newsletter from Japan: JPCA Show 2010
Monday, May 31, 2010 | Dominique K. Numakura, DKN Research    
The JPCA Show format has been reorganized--the organization wants to attract more visitors interested in PWB products and technologies and decided to add the several new events.
Flexible Thinking: Tempering Expectations in Printed Electronics
Thursday, May 20, 2010 | Joe Fjelstad, Verdant Electronics    
Printed electronics is clearly becoming a high-interest area for both product developers and investors. While it is good to be enthusiastic, and printed electronics definitely seem worthy of a good measure of enthusiasm, that enthusiasm should be grounded in facts and thoughtful reasoning.
Nano Scratch Testing: Silver Nano Ink on Polymer Substrate
Friday, April 16, 2010 | Pierre Leroux, NANOVEA    
The introduction of printed circuitry with the use of silver nano particles often called silver nano-inks, has brought value to electronic markets by reducing application material costs, increasing production throughput, adding new functionality to existing products, and enabling new applications.
COLUMNS    September 2, 2010
PAGE 1 of 7.     NEXT 10 RESULTS
 
The Next Stage of Assembly: 3-D and Solder-Free
Thursday, July 22, 2010 | Harvey Miller, Fabfile Online    
Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!
EPTE Newsletter from Japan: JPCA Show 2010, Part VI
Monday, July 12, 2010 | Dominique K. Numakura, DKN Research    
JPCA exhibitors that featured printable electronics fell into three categories: Material suppliers, manufacturing equipment and tool vendors, and electronics circuit/device manufacturers. Most executives affiliated with JPCA agreed that printable electronics must be included in business plans going forward.
EPTE Newsletter from Japan: JPCA Show 2010, Part V
Monday, July 05, 2010 | Dominique K. Numakura, DKN Research    
Fine-line generation could be considered the main dish of a multi-course meal offered by the printed circuit industry. Japanese PCB manufacturers, especially flexible circuit manufacturers, are continuously competing internally with their fine-line generation capabilities.
Paper or Plastic: How Would you Like Your Board?
Thursday, July 01, 2010 | Robert Tarzwell, DMR Ltd.    
Every now and then, a true technological breakthrough comes along. The paper circuit is just such a breakthrough. These new circuits--printed on standard photocopier paper--can be as complicated as fine-line 6-layer circuits, and they cost far less than traditional PCBs to build. But printing companies will have the jump on traditional PCB fabricators when it comes to paper circuits.
EPTE Newsletter from Japan: JPCA Show 2010, Part IV
Monday, June 28, 2010 | Dominique K. Numakura, DKN Research    
Embedded components/circuit boards were one of the most popular technical topics talked about at the JPCA Show in several years. This year's show featured a special corner, called "Embedded Components Circuit Boards," where more than a dozen companies contributed by displaying samples and panels to promote their latest technologies.
Speedstack with VMM: The Story Behind the Headline
Tuesday, June 15, 2010 | Pete Starkey, I-Connect007    
Polar's Speedstack system is in widespread use for documentation and design of impedance-controlled layer stack-up. The company has responded to demands to use the system without reference to libraries by releasing "Virtual Material Mode"--allowing designers and fabs the freedom to experiment with stack-ups and capture all impedance and layer allocation before they lock down the materials specification.
Integrating Advanced PCB Tech into Membrane PEC
Thursday, June 10, 2010 | Robert Tarzwell, DMR Ltd.    
PEC's big differentiator is this: Printed electronics enables a new group of manufacturers to build electronics. No longer is circuitry the exclusive domain of the PCB manufacturer; anyone with a silk screen set-up, a small imprint machine or a big multiline press can print multilayer advanced membrane electronic circuits.
EPTE Newsletter from Japan: JPCA Show 2010
Monday, May 31, 2010 | Dominique K. Numakura, DKN Research    
The JPCA Show format has been reorganized--the organization wants to attract more visitors interested in PWB products and technologies and decided to add the several new events.
Flexible Thinking: Tempering Expectations in Printed Electronics
Thursday, May 20, 2010 | Joe Fjelstad, Verdant Electronics    
Printed electronics is clearly becoming a high-interest area for both product developers and investors. While it is good to be enthusiastic, and printed electronics definitely seem worthy of a good measure of enthusiasm, that enthusiasm should be grounded in facts and thoughtful reasoning.
EPTE Newsletter from Japan: 2009 PWB Market Results
Monday, March 22, 2010 | Dominique K. Numakura - DKN Research    
Annual revenue for the industry in 2009 came in at 626.6 billion yen (US $6.5 billion), and has the infamous title of the largest negative growth year on record (-30%).
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