What do you want to search for?
Refine your search:
Choose a Topic:
When Published:

Type:




Where in the World?

Suppliers

54042 Records Searched4003 Matches
NEWS    September 2, 2010
PAGE 1 of 570.     NEXT 10 RESULTS
 
NewKyocera Tycom Purchases Remaining Share of Tycom Canada
Thursday, September 02, 2010 | BUSINESS WIRE    
Kyocera Tycom Corporation, formerly one-third owner, is pleased to announce that Tycom Canada, Ltd. is now a wholly owned subsidiary of Kyocera Tycom Corporation.
NewPolyonics Offers High Temp Substrates for Printed Electronics
Thursday, September 02, 2010 | Polyonics    
"By leveraging our years of experience in the printed circuit board label market, we are able to use our coated polyimide film that has established success in the surface mount and reflow process" notes Tom Rogers, Marketing Director at Polyonics.
NewAtotech Presents at IPCA Expo
Thursday, September 02, 2010 | Atotech    
Atotech will present "Potential Low-Cost Palladium-Alternatives for Activating Electroless Copper Deposition" during this year's show.
NewZuken Introduces Free CADSTAR Express 12.1
Thursday, September 02, 2010 | Zuken    
The free evaluation version of CADSTAR 12.1 with all the latest functionality, is now available to download from Zuken.com. The Express version allows designers to see for themselves how easy it is to use CADSTAR and experience its powerful technology enabling capabilities.
NewEnthone Introduces ENTEK OM PWB Final Finish
Thursday, September 02, 2010 | Enthone    
Enthone Inc., a business of Cookson Electronics, has introduced ENTEKŪ OM. The patented, Organic MetalŪ process delivers a visible, highly conductive PWB final finish that offers both ease of inspection and in-circuit testing (ICT).
Camtek to Present at Rodman & Renshaw Global Investment Conference
Wednesday, September 01, 2010 | PR Newswire    
Camtek Ltd. announced that its CEO, Roy Porat and CFO, Mira Rosenzweig will present at the Annual Rodman & Renshaw Global Investment Conference in New York.
DuPont Recognized for Electronics Leadership
Tuesday, August 31, 2010 | DuPont    
DuPont offers a broad and growing portfolio of innovative materials technologies for both semiconductor packaging and circuit applications.
Nan Ya Plastics' Q2 Income Doubles; Sales Up 69%
Tuesday, August 31, 2010 | Taipei Times    
Second-quarter sales climbed 39% from a year earlier to NT $55.5 billion, slower than the 69% increase in the previous three months, according to monthly exchange filings.
TUC Ramping-Up Halogen-Free CCL Shipments
Monday, August 30, 2010 | Digitimes    
Taiwan Union Technology expects its shipments of halogen-free copper-clad laminates to account for 30 to 35% of its total CCL shipments by year-end, up from 24% at the end of July 2010 and 7% last year.
CJ. Salvitech Releases New Products
Friday, August 27, 2010 | CJ. Salvitech    
CJ Salvitech S.L.'s collaboration with Four Stars-ES and Micronic Enterprise Co. Ltd has resulted in two new products to be released by the company. The upcoming 4-wire Kelvin feature of CJ Salvitech's Flying Probe Tester Evolution-2 is made possible with the R&D for the 4-wire Kelvin done by Four Stars-ES.
FEATURES    September 2, 2010
PAGE 1 of 9.     NEXT 10 RESULTS
 
NewEnthone Introduces ENTEK OM PWB Final Finish
Thursday, September 02, 2010 | Enthone    
Enthone Inc., a business of Cookson Electronics, has introduced ENTEKŪ OM. The patented, Organic MetalŪ process delivers a visible, highly conductive PWB final finish that offers both ease of inspection and in-circuit testing (ICT).
Camtek Appoints New CEO
Wednesday, August 25, 2010 | PR Newswire    
Roy Porat, who has been with Camtek since 2001 serving in various positions in the United States and Asia, and for the past two years as General Manager of the company, is to succeed Rafi Amit as CEO. Amit will become Active Chairman of the Board of Directors.
EPTE Newsletter from Japan: JPCA Show 2010, Part VII
Monday, July 19, 2010 | Dominique K. Numakura, DKN Research    
Materials are the most purchased items in the PCB industry for both business and technology customers. Material suppliers occupied the majority of the space at the show; however, many suppliers considered to be large players in the industry were absent. Why did they pass on this year's show?
Frontline Releases New CAM Solution
Thursday, June 24, 2010 | Frontline PCB Solutions    
Frontline PCB Solutions today announced the release of version 2.0 of InCAM--its new CAM solution for HDI and IC packaging production. The product introduces new functionality and significant improvements that increase data integrity and reduce job cycle time. The new Advanced Etch Compensation algorithm works up to five times faster than before.
LPKF Details 3-D Structuring Business
Wednesday, June 09, 2010 | Real Time With...IPC APEX Expo 2010    
Stephan Schmidt, President of LPKF's North American Business, outlines his company's booming 3-D structuring business and how the same drive toward miniaturization has led to opportunities in laser-based de-paneling.
Camtek Boasts New Inkjet Machine at APEX
Thursday, April 08, 2010 | Real Time With...IPC APEX Expo 2010    
Jason Rollo, General Manager of Camtek, sits down with Guest Editor Stuart Hayton and outlines the product launch of the company's new solder mask inkjet machine, which brings considerable cost and efficiency benefits to the application of solder mask to bare boards. They also discuss market conditions and the Camtek's ongoing business in North America.
DfR Solutions, ARINC Announce Partnership
Monday, April 05, 2010 | DfR Solutions    
DfR Solutions and ARINC today announced that the two companies have created a partnership to provide combined reliability and DMSMS support to the commercial government and defense industries.
Rogers: Focus on Frequency with New High-Speed Material
Wednesday, February 17, 2010 | Real Time With...DesignCon 2010    
Rogers introduced a new, high-speed laminate material at this year's DesignCon. Market Development Manager, Sean Mirshafiei, sits down with Editor Steve Gold to review the new Theta material's attributes and applications.
Merger Strategy Coming Together
Friday, January 22, 2010 | Real Time With...productronica 2009    
Rena Hoellmueller executive Albert Sadoine discusses his company's new culture and market strategies, such as improved process control, capacity, engineering and design, with PCB007 Editor, Steve Gold.
EIPC Speednews: European Institute of Printed Circuits
Tuesday, January 19, 2010 | EIPC    
The European Institute of Printed Circuits (EIPC) will hold the "EIPC-EBFRIP Workshop," to discuss implications and threats of the RoHS recast for the PCB sector, January 21, 2010.
ARTICLES    September 2, 2010
PAGE 1 of 6.     NEXT 10 RESULTS
 
EPTE Newsletter from Japan: JPCA Show 2010, Part VII
Monday, July 19, 2010 | Dominique K. Numakura, DKN Research    
Materials are the most purchased items in the PCB industry for both business and technology customers. Material suppliers occupied the majority of the space at the show; however, many suppliers considered to be large players in the industry were absent. Why did they pass on this year's show?
LPKF Details 3-D Structuring Business
Wednesday, June 09, 2010 | Real Time With...IPC APEX Expo 2010    
Stephan Schmidt, President of LPKF's North American Business, outlines his company's booming 3-D structuring business and how the same drive toward miniaturization has led to opportunities in laser-based de-paneling.
Camtek Boasts New Inkjet Machine at APEX
Thursday, April 08, 2010 | Real Time With...IPC APEX Expo 2010    
Jason Rollo, General Manager of Camtek, sits down with Guest Editor Stuart Hayton and outlines the product launch of the company's new solder mask inkjet machine, which brings considerable cost and efficiency benefits to the application of solder mask to bare boards. They also discuss market conditions and the Camtek's ongoing business in North America.
EPTE Newsletter from Japan: InterNEPCON Japan 2010, Part V
Monday, March 08, 2010 | Dominique K. Numakura - DKN Research    
Materials companies are back to the basics, and are promoting products with minor improvements using existing materials. A few of these include electrically conductive adhesives, an anisotropic conductive paste and photosensitive conductive ink.
Rogers: Focus on Frequency with New High-Speed Material
Wednesday, February 17, 2010 | Real Time With...DesignCon 2010    
Rogers introduced a new, high-speed laminate material at this year's DesignCon. Market Development Manager, Sean Mirshafiei, sits down with Editor Steve Gold to review the new Theta material's attributes and applications.
Merger Strategy Coming Together
Friday, January 22, 2010 | Real Time With...productronica 2009    
Rena Hoellmueller executive Albert Sadoine discusses his company's new culture and market strategies, such as improved process control, capacity, engineering and design, with PCB007 Editor, Steve Gold.
PCB Distributors Diving into Printed Electronics
Thursday, December 31, 2009 | I-Connect007    
A look at how two partners, Caledon Controls and Tapco, are exploring the printed electronics market with expectations of expansion.
A New Brand and Different Direction
Monday, December 28, 2009 | Real Time With...productronica 2009    
Maria Gonzalez of Gardien Independent Testing outlines the company's strategy for equipment sales and outsourcing services in the post-Mania era.
Atotech on HDI Reliability
Monday, December 21, 2009 | Real Time With...HKPCA & IPC Show 2009    
Stephen Kenny, Atotech's Global Product Manager, discusses the HDI reliability paper his company presented at the HKPCA & IPC Show and the technology behind the paper.
Mass Production Imaging: LDI for Lower Cost Per Panel
Wednesday, December 23, 2009 | Dror Shklarski, Marketing Mgr., PCB Division, Orbotech Ltd.    
Laser direct imaging (LDI) has emerged as an enabling tool that can print even the most complex and miniaturized designs more accurately than conventional methods--with higher yields at the throughput needed for mass production.
COLUMNS    September 2, 2010
PAGE 1 of 2.     LAST 9 RESULTS
 
EPTE Newsletter from Japan: JPCA Show 2010, Part VII
Monday, July 19, 2010 | Dominique K. Numakura, DKN Research    
Materials are the most purchased items in the PCB industry for both business and technology customers. Material suppliers occupied the majority of the space at the show; however, many suppliers considered to be large players in the industry were absent. Why did they pass on this year's show?
EPTE Newsletter from Japan: InterNEPCON Japan 2010, Part V
Monday, March 08, 2010 | Dominique K. Numakura - DKN Research    
Materials companies are back to the basics, and are promoting products with minor improvements using existing materials. A few of these include electrically conductive adhesives, an anisotropic conductive paste and photosensitive conductive ink.
The Sales Cycle: Is China Closed?
Thursday, December 17, 2009 | Barry Matties, The Sales Cycle    
If you're an equipment supplier and not already doing business in China, it may be too late to penetrate this market.
EPTE Newsletter from Japan: SEMICON Japan 2009
Monday, December 14, 2009 | Dominique K. Numakura - DKN Research    
Several energetic representatives were on hand at the exhibition from technical colleges and small companies hailing from northern Japan. These organizations did an extremely good job of promoting their unique technologies.
It's Not All Doom and Gloom
Monday, October 05, 2009 | Pete Starkey, I-Connect007    
"The European industry is still undergoing a period of re-alignment--look what's happening to some of the big names in Germany, for instance. I'm not sure we're out of the recession yet; it will be interesting to see the state of market next January," said Mark Goodwin, Managing Director, Global-Ventec Laminates UK Ltd.
The Gold Record: The Evolution of Entry Materials
Wednesday, July 22, 2009 | Steve Gold, I-Connect007    
An interview with Rocky Hilburn of LCOA underscores why entry materials are such an important--and often underestimated--part of the PCB drill process. Find out why engineering matters and how to discern between entry materials when reviewing competing products.
The Bare (Board) Truth: What Happens to Your CAM Files?
Wednesday, July 22, 2009 | Mark Thompson, Prototron Circuits    
What does the CAM department do to your files and what does that mean to you? The following is a brief synopsis of the edits that are likely to be performed at CAM prior to fabrication.
The Sales Cycle: Where Do Leads Come From?
Tuesday, July 07, 2009 | Barry Matties, The Sales Cycle    
All sales leads are not created equal. And fishing for leads can be frustrating, especially when you're fishing in the same lake as everybody else. Learn how you can you make sure you're casting your net in the right waters.
Who's Driving Your Boat?
Thursday, July 02, 2009 | Al Wasserzug, Vulcan Electronic    
Your company is a lot like a boat at sea. Well, who's driving that boat? Your answer could explain why you're either cutting through choppy waves or dead in the water.
The Sales Cycle: Taking the Risk Out of the Deal
Monday, April 13, 2009 | Barry Matties, I-Connect007    
Eliminating risk is a key to making sales. This is especially true in our industry, where capital-intensive purchases are often the norm. What is the risk for your buyers, and how will you help them overcome these obstacles?
MOST READ
MOST EMAILED