Enthone's research has focused on providing a solderable surface finish for PCBs containing organic nanometal. The first universal nanofinish was proposed four years ago. Now, the new-generation nanofinish with organic metal-Ag complex performs as well as any other surface finish with regard to aging resistance, discoloration and solderability.

Authors from Sandia National Laboratories investigate the solderability of current immersion Ag technology after exposure to conditions that simulate long-term storage followed by bake out environments prior to actual reflow assembly.

Rogers Corporation will be highlighting the benefits of its new 6.15 dielectric constant RO4360 laminate and RO4460 prepreg system at the upcoming Electronics Midwest 2010 exhibition.

Rogers Corporation will be featuring its latest addition to the high-speed digital market at this year's PCB West 2010 Exhibition at the Santa Clara Convention Center, September 29, 2010.

An expected recast of the RoHS (restriction of hazardous substances) environmental directive will likely carve away exclusions and possibly add new substances to the current list of six banned substances.

Based on recent surveys, PCB solder finishes are one of the most common cause of soldering defects and rejection of PCBs during assembly. Engineers highlighted solder finishes 35%, with delamination at 25%, third place were cosmetic faults.

Working together to address the latest round of proposed substance restrictions, IPC and the IPCA have submitted comments in response to the Indian Government's Ministry of Environment and Forests draft notification of E-waste (Management and Handling) Rules 2010.

In this paper, the authors report results from a study on incorporating pre-formed toughening materials into high-crosslink density phenolic cured resin formulations and the effect of the toughener on thermomechanical properties, toughness and drillability of the electrical laminates.

The new symposium will help attendees get up to speed on the latest regulatory developments from around the globe, including chemical regulations in Asia, changes to REACH and RoHS, implementation of system for labeling chemicals, the Canadian Chemicals Management Plan and California's Green Chemistry Initiative.

To help companies understand new laws, regulations and regulatory trends, IPC will hold an IPC Symposium on Electronics and the Environment on July 19-21, 2010, in Boston, Massachusetts.

Enthone's research has focused on providing a solderable surface finish for PCBs containing organic nanometal. The first universal nanofinish was proposed four years ago. Now, the new-generation nanofinish with organic metal-Ag complex performs as well as any other surface finish with regard to aging resistance, discoloration and solderability.

Authors from Sandia National Laboratories investigate the solderability of current immersion Ag technology after exposure to conditions that simulate long-term storage followed by bake out environments prior to actual reflow assembly.

This paper examines the thermal properties of various halogen-free laminates used in handheld electronic products and correlates these properties with manufacturing requirements. Thermal properties investigated include z-axis CTE, time to delamination at 260°C and 288°C and temperature to decomposition.

Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!

Materials are the most purchased items in the PCB industry for both business and technology customers. Material suppliers occupied the majority of the space at the show; however, many suppliers considered to be large players in the industry were absent. Why did they pass on this year's show?

In this paper, the authors report results from a study on incorporating pre-formed toughening materials into high-crosslink density phenolic cured resin formulations and the effect of the toughener on thermomechanical properties, toughness and drillability of the electrical laminates.

The effect of post-reflow cleaning processes on creep corrosion are discussed in this paper from Alcatel-Lucent.The authors examine a laboratory MFG test that replicates field creep corrosion. Comparisons of creep corrosion susceptibility between OSP and ImAg PWB surface finishes are also made.

The new symposium will help attendees get up to speed on the latest regulatory developments from around the globe, including chemical regulations in Asia, changes to REACH and RoHS, implementation of system for labeling chemicals, the Canadian Chemicals Management Plan and California's Green Chemistry Initiative.

Feel as though you were right there, in the EIPC Conference audience, with the second part of European Editor Pete Starkey's in-depth review of the many presentations made during the two-day event, presented in conjunction with SMT/HYBRID/PACKAGING.

This paper focuses on the effect of copper plating processes and chemistries on copper dissolution. Different Cu plating methods and chemistries were studied and compared. The paper will also review the impact of Cu plating processes (direct current plating versus pulse reverse plating), current density, plating chemistries and rectifiers on dissolution rate.

Authors from Sandia National Laboratories investigate the solderability of current immersion Ag technology after exposure to conditions that simulate long-term storage followed by bake out environments prior to actual reflow assembly.

This paper examines the thermal properties of various halogen-free laminates used in handheld electronic products and correlates these properties with manufacturing requirements. Thermal properties investigated include z-axis CTE, time to delamination at 260°C and 288°C and temperature to decomposition.

Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!

With proper planning, stiffeners can be designed to aid assembly through the designed manufacture of a flex circuit that can be handled as if it were a rigid circuit board. Such constructions can be accomplished by using any one of several methods.

Materials are the most purchased items in the PCB industry for both business and technology customers. Material suppliers occupied the majority of the space at the show; however, many suppliers considered to be large players in the industry were absent. Why did they pass on this year's show?

Corner cracks are observed less often than barrel cracks, but with high-rel boards, we can't be too careful. Unlike barrel cracks, which can fail catastrophically, knee cracks tend to propagate over time. The damaged pad actually resembles a funnel and the warp and weft of the glass give the funnel an uneven, puckered shape.

In this paper, the authors report results from a study on incorporating pre-formed toughening materials into high-crosslink density phenolic cured resin formulations and the effect of the toughener on thermomechanical properties, toughness and drillability of the electrical laminates.

The effect of post-reflow cleaning processes on creep corrosion are discussed in this paper from Alcatel-Lucent.The authors examine a laboratory MFG test that replicates field creep corrosion. Comparisons of creep corrosion susceptibility between OSP and ImAg PWB surface finishes are also made.

Couldn't make it to the recent EIPC Conference in Nuremberg? No worries: Feel as though you were right there, in the audience, with our European Editor Pete Starkey's in-depth review of the many presentations made during the two-day event, presented in conjunction with SMT/HYBRID/PACKAGING.

This paper focuses on the effect of copper plating processes and chemistries on copper dissolution. Different Cu plating methods and chemistries were studied and compared. The paper will also review the impact of Cu plating processes (direct current plating versus pulse reverse plating), current density, plating chemistries and rectifiers on dissolution rate.

Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!

With proper planning, stiffeners can be designed to aid assembly through the designed manufacture of a flex circuit that can be handled as if it were a rigid circuit board. Such constructions can be accomplished by using any one of several methods.

Materials are the most purchased items in the PCB industry for both business and technology customers. Material suppliers occupied the majority of the space at the show; however, many suppliers considered to be large players in the industry were absent. Why did they pass on this year's show?

Corner cracks are observed less often than barrel cracks, but with high-rel boards, we can't be too careful. Unlike barrel cracks, which can fail catastrophically, knee cracks tend to propagate over time. The damaged pad actually resembles a funnel and the warp and weft of the glass give the funnel an uneven, puckered shape.

Feel as though you were right there, in the EIPC Conference audience, with the second part of European Editor Pete Starkey's in-depth review of the many presentations made during the two-day event, presented in conjunction with SMT/HYBRID/PACKAGING.

Couldn't make it to the recent EIPC Conference in Nuremberg? No worries: Feel as though you were right there, in the audience, with our European Editor Pete Starkey's in-depth review of the many presentations made during the two-day event, presented in conjunction with SMT/HYBRID/PACKAGING.

The North American PCB industry is stronger--in spite of appearances to the contrary. Industry strength will help secure its place in the next chapter. The challenge will be to survive the winding down of Moore's Law on silicon while other materials and processes emerge to make possible future electronics advancements.

InterNEPCON Japan was established as a trade show dedicated exclusively to manufacturers and vendors associated with circuit board assembly, but has since evolved into one of Asia's largest exhibitions for electronics packaging, including SMT assembly.

IPC's Technet offers a snapshot of the issues of the day as hundreds of engineers attempt to sort out the industry's latest technological challenges. Harvey Miller, PCB007 columnist and President of Fabfile Online, has agreed to gather a few of the latest Technet exchanges for our Tech Tuesday readers.

The list of replacements for eutectic tin-lead keeps growing, and now, over three years after implementation of the lead-free mandate, new alloys are still being developed. How do you cut through the clutter and find the right alloy?