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Dec. 2011
2011 is gone, but not forgotten, thanks to our comprehensive look back at the PCB industry, including market summaries, technology trends and more!
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Nov. 2011
As boards get more compact and complex, saving real estate on top of the board has never been so important. This month, we look at how Embedded Components are helping the industry meet ever-increasing market demands.
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Oct. 2011
Automotive Electronics is the theme and this month’s articles cover how designers, suppliers and manufacturers are meeting the increasingly complex demands of the auto industry.
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Sept. 2011
Optical is the theme and this month’s articles give an eye opening perspective explaining new applications for optical interconnect in the electronics industry.
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August 2011
Plasma is the theme and this month's articles give an illuminating perspective explaining new applications for plasma in the electronics industry.
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July 2011
The "Imaging" issue shines a bright light on this hot subject with more than 40 pages featured.
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June 2011
The PCB Materials issue (aka "the UFO issue") explores the outer reaches of the world for space-age solutions for today's modern applications.
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May 2011
The premier issue of The PCB Magazine launched to rave reviews from the industry. See what people are talking about, download your copy today!
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December 2012
This month, our regular columnists take center stage and provide expert opinions and advice on just what 2012 meant for the industry, in the U.S. and abroad, and offer insights about what’s on the horizon.
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November 2012
Does the PCB industry really need to implement management techniques such as Lean or Six-Sigma in order to work efficiently, eliminate waste and deliver superior products and customer service? Find out this month!
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October 2012
This month, The PCB Magazine contributors from around the globe explore the effects and consequences of government regulations on the PCB and electronics assembly industries.
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September 2012
This month, experts in the field explore the latest developments in materials and manufacturing processes for flexible circuits, as well as novel design and application opportunities.
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August 2012

This month in The PCB Magazine, we open up the electronic industry Garmin to show you what industry insiders are saying about the importance of technology roadmaps.

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July 2012
In this month's issue, industry experts and technologists weigh in from around the globe for an in-depth look at PCB long-term reliability.
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June 2012
The June edition of The PCB Magazine takes an in-depth look at today’s PCB technology, its incremental improvements through the years, and what lies beyond traditional interconnection methods.
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May 2012
This month we take an in-depth look at the capabilities, limitations and developments in finishing processes.
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April 2012
This month, we explore how image processes are adapting to the rapid changes in technology.
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March 2012
Standards, Specifications and Approvals PLUS IPC APEX EXPO 2012 Special Coverage!
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Feb. 2012
It's a material world – and this month's issue proves it! More than ever, Printed circuit materials are being put to the test. Find out what happens when materials are pushed to extreme physical, mechanical, thermal and electrical limits.
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Jan. 2012
Our first issue of 2012 has feature articles, interviews and columns by industry veterans who have some pretty interesting ideas about what’s on the horizon for the PCB and electronics industries in 2012.
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December 2013

This month, our columnists provide a look back at 2013, and a glimpse of what’s in store for the PCB industry in 2014.

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November 2013
Mil/Aero for all our friends! This month, industry veterans explore (and help sort out) the sometimes complex world of military and aerospace electronics.
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October 2013

This month, The PCB Magazine gets in the race with automotive and transportation, bringing features on automotive electronics design challenges, MiB and more!

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September 2013

This month, The PCB Magazine presents the many sides of flex and rigid-flex circuits, which have myriad applications in just about every sector of the electronics industry.

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August 2013

Surf's up! Our columnists and industry experts will help you ride the wave of industry Standards and Regulations, so you come out on top and don't get wiped out!

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July 2013

This month, The PCB Magazine looks to the horizon at new and emerging interconnects.

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June 2013
Surface Finishes: this month's issue explores the latest developments in OSP's, ENIG and ENEPIG. A line-up of all-star columnists, and Real Time with… video selections adds industry insight to this topic.
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May 2013

With increasing design density and the introduction of microvia technology, the hole-formation operation has presented many challenges. Read some of the microvia success stories in this issue.

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April 2013
What are the limitations of contact printing processes and how can new developments in hardware and software minimize errors? What choices are available for digital direct-imaging techniques? We seek the answers.
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March 2013
Materials: With the enormous range of laminates available, what considerations determine the selection of an appropriate material for a particular application? Find out in this month's issue!
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February 2013
Industry veterans weigh in on advances in high-density interconnect technology, which have become established as enablers for a new generation of mobile devices and high-tech electronics.
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January 2013
High Reliability: What factors influence reliability, and how is PCB reliability measured? Find out this month!
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November 2014
This month, industry experts from Starfish Medical, DYCONEX AG, Micro Systems Technologies, and Nypro discuss the latest breakthroughs in medical applications for PCBs.
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October 2014
This month: end markets for PCBs! From the future of the domestic mil/aero market (looking good!) to wearables, automobiles, very thin PCBs for smartphones, and more!
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September 2014
This month, industry experts from Verdant Electronics, LPKF, Optomec and Transline Technology explore up and coming technologies for PCB fabrication, layout and more.
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August 2014
What is the story with printed electronics? Where have they been and where are they going? Most importantly, how are they being used in today’s market?
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July 2014
This month, The PCB Magazine feature contributors take an in-depth look at embedded components, including our cover story by EIPC’s Michael Weinhold: Device Embedding in PCBs: Evolution or Revolution?
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June 2014
This month, The PCB Magazine features industry experts who discuss all things flex: from substrates to hybrid stretchable circuits to 3D packaging tools and more! Don’t miss it!
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May 2014
This month, we bring you a line-up of experts who explore both common and unique plating & etching issues, techniques and challenges.
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April 2014
This month, the realm of HDI is explored, with features that delve into the issue of high-layer count multilayers, reliability, pinless registration & even bridging the divide between design & fabrication. Plus: IPC APEX EXPO show coverage!
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March 2014
It’s March materials madness in The PCB Magazine, with comprehensive coverage of materials, including features from leading experts at Ventec, Celestica, FTG, Rogers, Isola and an IPC APEX EXPO pre-show guide!
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February 2014
This month, The PCB Magazine brings the ins and outs of CAD/CAM especially for fabricators to the forefront with feature articles from the industry’s top experts
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January 2014

This month, The PCB Magazine brings surface finishes to the forefront with feature articles from the industry’s top experts. Plus, special content from productronica 2013!

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Welcome to the May 2011 digital edition of The PCB Magazine presented by PCB007.

I-Connect007 is excited to bring this easy-to-navigate, all-digital monthly magazine right to your inbox each month. The PCB Magazine promises to deliver everything you would expect from an I-Connect007 publication: feature articles and columns by industry experts, video shorts, interviews, news and events from around the world and more--all geared to serving the global printed circuit board fabrication industry.

Click here to subscribe now! It’s free, easy and the best way to stay on top of what’s happening in the PCB industry around the globe.

The inaugural May issue of The PCB Magazine is devoted to cost reduction and lean manufacturing. Featured in this edition are articles on 3D Interconnection Technologies and MEMS. And, if you missed the IPC APEX EXPO show in Las Vegas this year, remember you can catch all the action from the show at www.realtimewith.com. We produced over 160 videos with leading experts covering all facets of the industry. Pete Starkey gives us a retrospective in his column this month as well.

We hope you enjoy The PCB Magazine!

The I-Connect007 Team

PS: Let us know what you think, we appreciate your feedback. Click Here for our feedback form.

The June 2011 issue of The PCB Magazine includes compelling articles and video on this month’s theme--materials!

Industry leaders from Oracle, Rogers Corp., Insulectro, Saturn Electronics and more weigh in with Feature Articles on topics surrounding today’s PCB materials. Be sure to check out our regular columns, like Karl Dietz’s Tech Talk, and Paul Reid’s Reid on Reliability, along with new contributor Steve Williams and his Point of View that promises a clear perspective on American manufacturing.

Feature videos from the IPC APEX EXPO in Vegas 2011 and one from IPC Midwest 2010 include our RealTime with... footage on industry hot topics including like copper foil technology and ceramic core material. There’s also the second of five installments from Dale Smith on Lean Manufacturing, and Part Two of Barry Olney’s PCB Design Techniques for DDR, DDR2 & DDR3.

We hope you enjoy the June issue of The PCB Magazine!

July 2011 issue of The PCB Magazine--including compelling articles and video on this month’s theme--imaging! Also, plenty of other great content is included, like our new News Highlights section featuring up-to-date announcements from four areas: milaero, flexible circuits, design and new products.

Industry leaders from HTP HiTech Photopolymere AG, MuTracx, MicronSi, and others weigh in with Feature Articles on topics surrounding today’s imaging challenges, the history of imaging products and processes, and a look ahead to what’s coming.

Be sure to check out our regular columns, like Karl Dietz’s Tech Talk, and Harvey Miller’s Fab File, along with new contributor Steve Williams and his Point of View that promises a clear perspective on how unions are affecting the return of manufacturing to America.

The August 2011 issue of The PCB Magazine includes feature articles, columns and interviews on this month's theme--plasma!

Industry leaders from Semblant, Nordson MARCH, Cleantech Investor, and more provide illuminating perspectives and informative articles explaining new applications for plasma in the electronics industry, along with overviews of the history that this fourth form of matter has had in manufacturing for nearly 100 years!

Our comprehensive list of August columnists includes John Coonrod, Barry Olney, Steve Williams, Mike Carano, Dale Smith, newcomer Gray McQuarrie, and of course, I-Connect007 Publishers Ray Rasmussen and Barry Matties.

Rounding out our content this month are three interviews, beginning with Marcy LaRont’s Conversations with…Imagineering, followed by two video interviews from our RealTime with…IPC 2011 series. In the first, Guest Editor Stuart Hayton speaks to Rogers Corporation’s Greg Bull about receiving the New Product Innovation Award. In the second, Guest Editor Pete Starkey explores emerging uses for plasma with Semblant’s Tim Von Werne. Don’t forget to take a look at our recently added Highlights section, with up-to-date announcements from milaero, flexible circuits, design and new products/supplier news.

Download the all-digital September 2011 issue of The PCB Magazine -- including feature articles, columns and interviews on this month's theme -- optical interconnect!

Industry leaders from Calumet, ESCATEC and Altera, along with Happy Holden, Penumbra’s Steve DeWaters, Caltech and more, provide a long list of feature articles that put it all together when it comes to the many ways the technology is rapidly changing with regard to bringing fiber optic connections to the board level.

Our comprehensive list of September columnists includes Barry Olney, Karl Dietz, Mike Carano, Dale Smith, and Steve Williams. I-Connect007 Publishers Ray Rasmussen and Barry Matties bookend the issue with their columns, The Way I See It and The Sales Cycle. You definitely do not want to miss their unique perspectives this month!

Like every month, we round out our content with relevant videos, and these are worth watching, especially on a late-summer morning: First, there is Guest Editor Glenn Oliver and Jamal Izadian discussing flex materials for interconnect capabilities; next, Endicott Interconnect’s Jim Fuller on his company’s role in integrated and advanced circuit manufacturing and assembly; and finally, Honeywell’s Vicka White interviewing Paul Reid for his take on why he believes this is the "Year of Design."

Don’t forget to take a look at our recently added Highlights pages, with up-to-date announcements on things to do, see and know about in MilAero, Flex, Design and New Products/Supplier News.

Download the all-digital October 2011 issue of The PCB Magazine -- including feature articles, columns and interviews on this month's theme -- Automotive Electronics!

Industry leaders from Rogers, Freedonia Group and Waysystems Group and more, provide a long list of feature articles explore the increasingly complex electronic systems require PCBs to accommodate functionality and space issues, as well as the performance, reliability and infotainment demands of today's automobile.

Our comprehensive list of October columnists includes Barry Olney, Karl Dietz, Mike Carano, Dale Smith, Steve Williams, John Coonrood and Gray McQuarrie. I-Connect007 Publishers Ray Rasmussen and Barry Matties bookend the issue with their columns, The Way I See It and The Sales Cycle. You definitely do not want to miss their unique perspectives this month, including our look at "How Apple Changed the World".

Like every month, we round out our content with relevant videos. This month's videos feature Dieter Bergman and Dan Gamota, who offer perspectives on standardization.

Don’t forget to take a look at our recently added Highlights pages, with up-to-date announcements on things to do, see and know about in MilAero, Flex, Design and New Products/Supplier News.

Download the all-digital November 2011 issue of The PCB Magazine -- including feature articles, columns and interviews on this month's theme – Embedded Components!

As the market calls for more complex, compact circuit boards, saving real estate on top of the board becomes increasingly important. That’s why the use of embedded passives continues to gain ground is the electronics assembly process. Industry experts from Endicott Interconnect, Ohmega, Hofmann Leiterplatten as well as Harvey Miller provide a long list of feature articles that cover the ever-changing world of EP from all sides.

In our columns department, industry favorites Karl Dietz(Tech Talk), Steven Williams (Point of View), Mike Carano (Trouble in Your Tank), Barry Olney (Beyond Design) and GrayMcQuarrie (Solving DAM Problems) provide insights and perspectives unique to their specialties and experience within the electronics industry. Publishers Ray Rasmussen and Barry Matties also have a few things to say in The Way I See It and The Sales Cycle. This month, Ray’s looking at onshoring, the way he understands it, and Barry offers some sound advice on something that may just hurt a little: the truth.

Don’t forget to take a look at our recently added Highlights pages, with up-to-date announcements on things to do, see and know about in MilAero, Flex, Design and New Products/Supplier News.

From EP-related feature articles to video and industry sector highlights, we’ve got the monopoly on PCB industry news right here!

Download the all-digital, December issue of The PCB Magazine now! 2011 is gone, but not forgotten, thanks to our comprehensive look back at the PCB industry, including market summaries, technology trends and more!

We’re wrapping up 2011—a short calendar year for The PCB Magazine, which debuted in May—thanks to the help of feature contributors from IPC, Mentor Graphics and DownStream Technologies, in addition to regular columnists like Karl Dietz, John Coonrod and Abby Monaco, who provide their perspectives on the state of the PCB industry, 2011.

Straight from the tradeshow floor in Munich are the first of a huge catalog of newly produced video content from productronica, including interviews with Walt Custer, Atotech’s Dieter Walz, Joe Fjelstad and atg Luther and Maelzer.†

Don’t miss our columns department, starring Gray McQuarrie, Barry Olney, Steve Williams, Mike Carano and of course, our publishers, Barry Matties and Ray Rassmussen.

Don’t miss this all-inclusive look back at 2011—The PCB Magazine style!

Download the all-digital, January issue of The PCB Magazine now! Our first issue of 2012 has feature articles, interviews and columns by industry veterans who have some pretty interesting ideas about what’s on the horizon for the PCB and electronics industries in 2012.

This month, DownStream Technologies takes a look at three key areas of interest for the coming year and Mentor Graphics scopes the state of PCB design technology best practices and how it relates to the economy’s gradual recovery. Other contributors include a handful of regular columnists who’ve taken their opinions to feature status: Gray McQuarrie provides commentary on the second chance for making our manufacturing the best in the world. Regular PCB007 columnist Martyn Gaudion presents his unique perspective on what’s to come from a signal integrity point of view and Steve Williams explains how 2012 may be the “year of retrenching.” Other feature contributors include PentaLogix and Databeans, who offer plenty of insight into what to expect in 2012.

Don’t miss our columns department, starring Dale Smith, Barry Olney, Mike Carano and of course, our publishers, Barry Matties and Ray Rassmussen.

In our Articles Department, we’ve got veteran I-Connect Tech Editors, Harvey Miller and Pete Starkey. Miller, with his expert awareness of the domestic PCB industry, offers a comprehensive look at the state — and chances for survival — for the U.S. PCB shop. Fresh from productronica, Starkey shares an interview he conducted with Rainbow Technologies Founder Jonathon Kennett, who explains his take on primary imaging, Rainbow style. We also have a fresh handful of productronica videos and our industry highlights sections covering milaero, flex, new products, events and more.

2012 is here, folks, so be aware…be very aware — with the help of The PCB Magazine!

Download the all-digital, February issue of The PCB Magazine now!

Printed circuit materials have to satisfy many masters— physical, mechanical, thermal and electrical to name just a few. From laminates options and the bewildering catalogue of material properties and characteristics, how are the right materials chosen? What are the latest advances in technology and how can they help the designer achieve required performance levels? This month we’ve got the answers, with feature articles from Saturn Electronics, Dupont, Ventec Europe Limited and more!

Don’t miss our columns department, starring Dale Smith, Barry Olney, Mike Carano, Gray McQuarrie and of course, our publishers, Barry Matties and Ray Rassmussen.

In our Articles Department, veteran editor Joe Fjelstad explores the continuing evolution of Flexible Circuit Solutions. Volker Feyerabend of APROS Int. Consulting presents an in-depth look at Advanced Routing Technologies; specifically, Depth Routing.

Also check out our comprehensive 2012 IPC Apex Expo preview!

Standards and specifications are fundamental to the PCB industry both locally and internationally. These carefully crafted industry tools harmonize fabrication processes and safety requirements and define reproducible levels of product quality and reliability. However, several questions must be addressed: Which standards are relevant to PCBs? Who is responsible for writing and enforcing them and what is there to gain by participating in the process? The March edition of The PCB Magazine navigates the who, what and why of today’s industry standards with feature articles from IPC, IEC, ANSI, Abby Monaco and Joe Fjelstad.

Don’t miss our IPC APEX EXPO 2012 special section, with fresh video content featuring interviews with the industry’s leading technologists, engineers, designers and fabricators, in addition to first-person accounts by I-Connect007 guest editors who relate their experiences at the technical conferences, standards meetings and panel discussions held throughout the show.

This month, The PCB Magazine offers expert analysis of imaging technologies, in addition to imaging process issues, such as the pros and cons of photolithographic and digital techniques, and how successive images are aligned and kept in register.

Check out this month’s Feature Articles from industry veterans including Stuart Hayton from MuTracx, Karl Dietz, Agfa Materials’ Eric Janssens, Joe Fjelstad and more.

Also included are on-the-floor reviews of CPCA 2012, IPC APEX EXPO video interviews and of course, our regular line-up of columnists offering plenty of technical advice, common sense management ideas and market predictions.

The range of capabilities, limitations and developments in finishing processes are examined this month, from feature article contributors George Milad (Uyemura), Joe Fjelstad, Mike Carano (OMG Electronic Chemicals), and Gerard O’Brien (ST and S Group). Plus, straight from IPC APEX EXPO is Yakov Bulayev’s Technical Conference paper on HDI Imaging.

As always, our columns department offers a wealth of technical advice, common sense management ideas and market predictions from industry veterans around the world.

This month, industry experts weigh in on today’s PCB technology, its incremental improvements through the years, and what lies beyond traditional interconnection methods, including potential future developments in electronics.

The June edition of The PCB Magazine looks beyond the horizon at how alternative approaches may influence the future.

Don’t miss our original video content, industry highlights, and of course, our columns department, offering plenty of technical advice, common-sense management ideas and market predictions from industry veterans around the world.

It’s high times for The PCB Magazine readers this month, with a current and future view of high-reliability PCBs—from military and aerospace technology to automotive applications.

How does the PCB fabricator ensure performance? What factors influence reliability?

Industry experts and technologists weigh in from around the globe for an in-depth look at PCB long-term reliability.

Our highlights, columns department and original videos round out the issue, with plenty of advice, common-sense management ideas and market predictions from industry veterans representing a variety of industry niches.

This month in The PCB Magazine, we open up the electronic industry Garmin to show you what industry insiders are saying about the importance of technology roadmaps, and why combining information and experience from global OEM and EMS companies, suppliers, academic and government sources, and trade associations, is vital for the health of our industry.

Check out our regular columnists, original video content and highlights sections, aimed at keeping you current with news from a variety of industry sectors including mil/aero, flex, and more!

Flex and Rigid-Flex PCBs

They bend! They stretch! They leap tall buildings! Okay, maybe not that last one. Nevertheless, flex and rigid-flex circuits have myriad applications in just about every sector of the electronics industry, where their ability to be formed into complex three-dimensional final geometries, or withstand multiple flexing cycles during their functional life, adds a third dimension to the concept of the interconnecting substrate.

This month, experts in the field explore the latest developments in materials and manufacturing processes for flexible circuits, as well as novel design and application opportunities.

Government Regulations: A Real Balancing Act

Arguably, a main function of government is to create rules, but what rules are necessary or desirable, and what benefits do they bring to our industry?

Environmental legislation worldwide is causing a total rethink of product design and manufacturing processes. This month, The PCB Magazine contributors from around the globe explore the effects and consequences of government regulations on the PCB and electronics assembly industries.

Management Disciplines: What's in Your Toolbox?

Management disciplines vary in the PCB industry; many companies subscribe religiously to one, others incorporate a blend of several, while some navigate the stormy seas of manufacturing alone--and it shows.

Do companies really need to implement management techniques such as Lean, Six-Sigma or Kaizen in order to work efficiently, eliminate waste and deliver superior customer service? Read the arguments for and against in the November issue of The PCB Magazine.

Year-End Wrap-Up

The global PCB industry is all over the map—literally! This month, our regular columnists take center stage and provide expert opinions and advice on just what 2012 meant for the industry, in the U.S. and abroad, and offer insights about what’s on the horizon. One thing is for certain—the Maya just have to be wrong! 2013 here we come!

HIGH RELIABILITY

This month, our authors scrutinize high-reliability PCB applications, where failure is absolutely unacceptable and the potential cost consequence of failure are enormous. What factors influence reliability, and how is PCB reliability measured? Find out this month!

Feature articles include: HDI Use in Optical Waveguides by Happy Holden; Built Board Tough: Budget DC Copper Plating for High Reliability and Increased Capabilities by Yash Sutariya; Heavy and Extreme Copper for Maximum Reliability in PCB Design and Fabrication brought to you by Epec Engineered Technologies; and High-Reliablity PCBs in Mil/Aero Applications by Zulki Khan.

We also feature an interview with Robert Tulman of Eltek, Ltd. where he discusses some of the technological issues involved in reliability of PCBs for military, aerospace, medical and industrial equipment applications.

This month, industry veterans Happy Holden, Mike Carano, Joe Fjelstad and others weigh in on advances in high-density interconnect technology that have become established as enablers for a new generation of mobile devices and high-tech electronics.

This issue also features our exclusive IPC APEX EXPO 2013 Pre-show Coverage, which includes information on technical conference sessions, standards development meetings, certification programs, IPC Buzz Sessions, a Real Time with... video overview, and much more.

The Materials Report

This month, experts from Oracle, Aismalibar, Invotec, and more report on materials, with feature articles that examine the wide range of advanced materials available today, and explain how to determine the appropriate material for a specific application.

We also bring you the Post-Show Coverage from this year's IPC APEX EXPO from San Diego.

Focus: Imaging Processes

This month, Atotech presents a comprehensive view of the next generation of resist stripper solutions, with emphasis on fine-line applications, while Rainbow’s John Cunningham discusses production issues in the imaging process. Finally, Mutracx’s Stuart Hayton is on hand to offer an update on PCB imaging technologies and the challenges faced by innovators in this sector.

Small Hole Formation and Processing: Microvia Success Stories

This month, experts from Saturn, Potomac Photonics, Uyemura and Atotech explain the "ins and outs" of small hole fabrication and processing, including the benefits and limitations of mechanical drilling vs. laser, chemistry challenges in the plating process, and more.

Don’t miss our newest columnist, George Milad of Uyemura, who debuts his new column, The Finish Line, with "Acid Copper Plating for High Aspect Ratio and Via Fill."

Surface Finishes

This month’s feature articles by OM Group’s Mike Carano, Uyemura’s George Milad and Don Walsh, and CEMCO’s Peter Lymn, who all do their part to explain newest developments in OSPs, ENIG and ENEPIG. I-Connect007 Technical Editor Pete Starkey provides an interview with Semblant’s Steve McClure on the progress of the company’s introduction of SPF to the industry.

We’ve got a line-up of all-star columnists on hand this month, including Gray McQuarrie, Mike Carano, Judy Warner, Karl Dietz and Steve Williams. Real Time with…video selections round out our Surface Finishes issue with related discussion from industry veterans that we captured at IPC APEX EXPO 2013.

What are you waiting for? Click NOW!

This month, The PCB Magazine looks to the horizon at new and emerging interconnects, with features by BPA and Ormet, along with a comprehensive collaboration between nScrypt and the University of Texas, El Paso.

Our columnists have a few things to say also, including advice on operational excellence, WIP strategies, PTH void troubleshooting, soldermask processing issues and MORE!

Get it while it’s HOT!†

Standards & Regulations

Navigating the industry’s standards and regulations can be a lot like surfing a killer wave: One misstep and you could wipe out!

As EIPC Technical Director Michael Weinhold discusses with I-Connect007’s Pete Starkey, are standards and regulations a threat, or an advantage? Also on hand: Dan Gamota, who addresses standards for the monetization of PE,Dennis Fritz on the newly developing efforts of CAMEST, and IPC’s Dave Torp.

All this and much more are in this month's issue of The PCB Magazine.

This month, The PCB Magazine presents the many sides of flex and rigid-flex circuits, which have myriad applications in just about every sector of the electronics industry, where their ability to be formed into complex three-dimensional geometries, or to withstand multiple cycles during their functional life, adds a third dimension to the concept of the interconnecting substrate.

Don’t miss our features by Victor Lazaro Gallego and Roberto Tulman, Joe Fjelstad, and more!

AUTOMOTIVE & TRANSPORTATION

This month, features from Saturn, BPA Consultants, Zuken and Delphi take on some big questions, beginning with whether or not a PCB manufacturer should even pursue the automotive electronics market, and address the power of MiB, automotive PCB design challenges, and more!

Mil/Aero Edition

This month, STRATeVU’s Steve Dewaters demystifies the often complex world of military electronics and DoD spending, while Graphic Plc’s Ashley Luxton demonstrates the utility of applications engineering to PCB design and manufacturing. Finally, Circuit Solutions’ John Vaughan explores the intersection of unmanned vehicle systems and electronics technology.

Welcome to the end! (of 2013, that is!)

This month, we let our columnists call the shots and gave them an opportunity to provide a year-end wrap-up from their point-of-view. Feature columnists Ray Rasmussen, Steve Williams and Gray McQuarrie provide a look back at 2013, and a glimpse of what’s in store for the PCB industry in 2014. You’ll also find our other monthly columnists on hand, including Karl Dietz, Michael Carano and George Milad providing the fine technical columns you’ve come to expect.

As a Christmas bonus, we’ve included a batch of fresh, hot Real Time with… video straight from productronica 2013.

This month, experts from Uyemura, Epec, and Fischer Technology take a deep look into surface finishes, including newest processes, pros and cons of available surface finishes, and more!

Don’t miss our productronica 2013 coverage, including thoughts from Pete Starkey and photos from the show floor!

CAD/CAM

This month, experts from Altium (Ben Jordon), CadSoft (Mark Toth), Mentor Graphics (Julian Coates), and Prototron Circuits (Mark Thompson) bring you in-depth articles that detail the ins and outs of CAD/CAM for fabricators.

Plus: Columns, Real Time with… and more!

Materials Issue

Our comprehensive line-up this month includes our cover story by Ventec’s Ian Mayoh (Materials for High Operating Temperatures), plus more than a half-dozen other features from industry leaders at Celestica, FTG, Rogers, Isola, Dupont and more! Don’t miss our IPC APEX EXPO pre-show guide with schedules, offerings and featured programs.

Our feature line-up this month includes a co-authored cover story from Happy Holden (didn’t he retire?) and Mike Carano, who teamed up to provide an up-to-date look at the challenges of high-layer count multilayers. Plus, Paul Reid lends his expertise into HDI reliability, Raytheon’s Dan Smith offers his unique perspective on bridging the gap between design and fabrication, and Victor Lázaro Gallego walks us through the pinless registration process for multilayer in a Real Time with… feature video. Don’t miss our IPC APEX EXPO show coverage, with interviews, overviews and pictures from the show floor!

Plating and Etching

This month, our features include industry veteran Mike Carano, who brings a detailed look at direct metallization for complex IC designs in this month’s cover feature; Henning Huebner and a team from Atotech, Germany, explore the challenges of copper filling of BMVs, and Dr. Andy Cobley et al., from Coventry University, U.K., share their findings on the effect of low frequency ultrasound on catalysed electroless copper plating.

We’re also bringing you fresh Real Time with...videos from IPC APEX EXPO 2014, an in-depth panel discussion video Has Outsourcing Lost its Luster? sponsored by Prototron Circuits, interesting columns and more!

FLEX CIRCUITRY

This month, our cover feature by Scott Gordon (DuPont Teijin Films) explores polyester films for the flex industry. Inside features include articles from A. Robinson, et al., (Journal of Applied Physics), who take a look at hybrid stretchable circuits; Joe Fjelstad (Verdant Electronics) discussing some basic principles of PTF flex circuits; and All Flex’s Dave Becker, who examines 3D packaging tools.

Don’t forget: Real Time with…video from IPC APEX EXPO, a brand new I-Connect007 Panel Discussion (What’s New in Flex?) columns, and more, including Pete Starkey’s update on the ECWC13 held in Nuremberg, Germany in May.

EMBEDDED COMPONENTS

Our July line-up includes our cover story by EIPC’s Michael Weinhold: Device Embedding in PCBs: Evolution or Revolution?

Other feature contributors include John Andresakis, et al. (Oak Mitsui), Daniel Brandler and Manuel Herrera (Ohmega Technologies Inc.), and Todd Kramer (Secure Components).

PRINTED ELECTRONICS

What is the story with printed electronics? Where have they been and where are they going? Most importantly, how are they being used in today’s market? These questions and more are addressed by this month's feature contributors from IPC, OE-A, and more.

Features

  • Printed Electronics 2014: World Standardization Effort: Growing Opportunities for Collaboration, by Marc Carter, IPC
  • Hybrid Systems for Organic and Printed Electronics, by Klaus Becker, OE-A
  • Piezoelectric, Pyroelectric, and Ferroelectric Materials for Printed Electronics, by Josh Goldberg, Taiyo America
  • Conductive Ink Market: Photovoltaic and Touch Screen Sectors, by Dr. Khasha Ghaffarzadeh, IDTechEx

PCB Magazine September issue:

New Concepts and Emerging Technologies for PCB Fabrication

Table of Contents

Features

  • Aluminum Base Circuit Technology, by Joe Fjelstad, Verdant Electronics
  • 3D LDS Components for New Opportunities in PCB Layout and Production, by Malte Borges, LPKF
  • The Road to Production Grade/Scale Printed Electronics, by Ken Vartanian, Optomec
  • Additive Technology for PCB Fabrication, by Judy Warner, Transline Technology

Columns

  • The Way I See It: The Family Sunstone, by Ray Rasmussen (Feature Column)
  • Testing Todd: Where do we go From Here? by Todd Kolmodin
  • Trouble in Your Tank: Root Causes of Failures in PWB Lamination, by Mike Carano
  • Point of View: Best Practices 101, Part 2, by Steve Williams

More…

  • Reader Response: And the Data Transfer Beat Goes on…latest fromKarel Tavernier/Julian Coates debate
  • Real Time with…IPC APEX EXPO 2014

Don’t forget: If you have some expertise of your own to share in the form of a feature article or column, or just want to share some feedback with us on something you’ve read on our pages, please drop us a line!

End Markets for PCBs

Features
  • Up, Up, and Away: Reasons for Renewed Optimism in the Mil/Aero PCB Market, by John Vaughan, Circuit Solutions
  • Wearable Electronics Driving the Need for a New Level of Systems-in-Package Performance, by Desmond Wong and Bill Burr, TransSip Inc.
  • New Regulations Clarify U.S. Export Controls for Defense PCBs, by Fern Abrams, IPC
  • PCBs for Automobiles: What to Wear to the Party? by Yash Sutariya, Alpha Circuit Corporation
  • Thin PCBs for Smartphones: Technology and Reliability Considerations, by Thomas Krivec, et al., AT&S
  • The Smart Grid Opportunity, by Bill Burr, BPA Consulting

Columns

  • The Way I See It: New Young Voices Finding the Right Tune to Sing, by Ray Rasmussen
  • Trouble in Your Tank: Oxide Alternatives to Enhance LPI Adhesion to Copper, by Michael Carano
  • Karl’s Tech Talk: Dry Film Photoresist Adhesion Tests, by Karl Dietz
  • Point of View: Best Practices 101, Part 3, by Steve Williams
  • Testing Todd: What is 4-Wire Kelvin? by Todd Kolmodin

More

  • Real Time with…SMTAI 2014, Most Read News Highlights and More!

Don’t forget: If you have some expertise of your own to share in the form of a feature article or column, or just want to share some feedback with us on something you’ve read on our pages, please drop us a line!

Medical Applications for PCBs

Features

  • Noble Metal PCB Manufacturing for Direct Implants, by Daniel Schulze et al., DYCONEX AG/MST
  • PCBs for Medical Applications: A Designer’s Perspective, by Kenneth MacCallum, Starfish Medical
  • Wearable Electronics: The Shape-Shifting Future of Medical Devices, by Gary Baker, Jabil
  • Medical Electronics Market Outlook 2020, Research & Markets

Columns

  • The Way I See It: IPC Seal of Approval, by Ray Rasmussen
  • Trouble in Your Tank: Lead-Free Compatible OSPs: What Does This Really Mean? by Mike Carano
  • Point of View: Best Practices 101: Pt. 4, by Steve Williams
  • Testing Todd: Flying Probes Expanded, by Todd Kolmodin
  • Solving DAM Problems: Solving a True DAM Problem, by Gray McQuarrie

More

  • Real Time with…SMTAI 2014, Industry News Highlights and More!

Don’t forget: If you have some expertise of your own to share in the form of a feature article or column, or just want to share some feedback with us on something you’ve read on our pages, please drop us a line!

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