The overwhelming success of the seminar in early September has prompted Trace Laboratories to schedule two additional RoHS/Lead Free seminars with Dr. Jennie Hwang. The seminars will be held on January 9, 2007 at Trace's Palatine, IL facility and January 23, 2007 at Trace's Hunt Valley, MD facility.

Dr. Jennie S. Hwang, author, consultant and world-renowned industry expert on lead-free reliability and RoHS compliance will lead two, two-session seminars hosted by Trace Laboratories. These two-session seminars will address the principles and practices constituting lead-free reliability testing. Topics will include how to assess reliability and what tests to perform to determine reliability. The seminars will include a tour of the Trace facilities and a discussion on key RoHS testing capabilities and concerns.

Each attendee will receive a copy of Dr. Hwang's two textbooks on lead-free technology: "Environment-Friendly Electronics - Lead-Free Technology" published by Electrochemical Publications, Great Britain (list $238) and "Lead-Free Implementation - A Manufacturing Guide", published by McGraw-Hill, USA (list $99.95).

These are one-day, two-session seminars. The price for the two sessions is $499. The price for one session is $299. Space is very limited. Lunch will be provided.

The course is divided into two sessions: the AM session covers all relevant topics on lead-free reliability including: 1.Factors; 2.Tests; 3.Integrated test results & interpretation; 4. Fundamentals; 5. Final assessment. The key factors affecting the Pb-free solder joint reliability as well as the component and assembly will be summarized. The question on "how many and which tests should be performed?" will be rationalized. The validity of selected test parameters and test results will be outlined. The PM session discusses the prevalent phenomena, why they are related to reliability and how to mitigate their probability of occurrence, such as tin whisker, BGA black-pad failure and solder joint surface crack, high process temperature effects. The PM session also includes a tour of Trace Labs and the illustration of specific testing devices/apparatus and programs. The underlying distinction between Pb-free and SnPb in relation to reliability will be discussed. Relevant industry standards will also be outlined. Ultimately the combined information addresses the question of "How to Assess Pb-free Reliability?" and "What are the crucial criteria to be considered?"

AM Topics

-Define reliability.
-Key distinctions between Pb-free and SnPb in relation to reliability.
-Key commonalities between Pb-free and SnPb in relation to reliability.
-Factors affecting solder joint reliability: Material properties & microstructure; Process temperature; Role of gold in Pb-free vs. SnPb; Role of intermetallics in Pb-free vs. SnPb.
-Tests and test results: Stress-strain relationship, creep, fatigue; Isothermal fatigue vs. temperature cycling fatigue; Thermal shock, aging, drop test; Examples of fatigue/creep test results, HALT/HASS.
-Scenario discussion -solder joint reliability of QFP/SO components: Test results with SnBi-coating vs. SnPb-coating and data interpretation.
-Scenario discussion -solder joint reliability of BGA components: Test results with or without the mixed use of SnPb and Pb-free and data interpretation.
-Industry standards (J-STD-001D, J-STD-610D, J-STD-002, J-STD-003, J-STD-004, J-STD-005, J-STD-006, J-STD, MIL-STD-883, ASTM Standards).
-Integrated results: Evaluation of data, drawing conclusions.
-Fundamentals: Basic failure processes; Differentiation of Pb-free solder joint failure mode vs. SnPb; Alloy strengthening mechanisms vs. test results.
-Life-prediction modeling: Principles and parameters.
-Revisit reliability.
-Summary.

PM Topics

-How to mitigate tin whiskers by knowing what the likely causes are and how to test.
-Is solder joint void an issue? What are various sources? How to minimize voids.
-Is surface crack a reliability issue? What are the causes and can it be avoided?
-What level of Pb contamination is acceptable and how is it related to performance?
-What are the implications of BGA solder ball drop under SAC solder paste reflow and what are the solutions?
-How to handle and minimize PBGA package cracking and its relation with process.
-What are the precautions for successful high-pin-count large PBGA/CBGA rework?
-Why a failure like BGA black-pad crack is a concern.
-Is re-balling of BGA a good practice?
-Trace Labs tour & testing programs.
-Failure analysis examples.
-Alloy strengthening mechanisms vs. tests.
-High fatigue-resistant Pb-free solder vs. SnPb.
-Key tactics to enhance solder joint reliability.
-Key tactics to ensure PCB assembly reliability.
-Reliability vs. business plan vs. cost.
-Re-define the reliability (absolute performance vs. relative performance).
-Summary.

About the Instructor

Dr. Hwang brings her 26-year SMT manufacturing experience combined with her 16-year lead-free R&D and hands-on production implementation to this lecture series. She is a major contributor to SMT manufacturing since its inception. She has provided hands-on solutions to challenging production issues as well as served as an advisor to the U.S. government and OEM/EMS companies worldwide.

Among her various awards and honors are citations by the U.S. Congressional Certificates of recognition; election to the National Academy of Engineering; being named the R&D-Stars-to-Watch; recipient of YWCA Women Achievement Award; and induction to the WIT International Hall of Fame.

Hwang is a holder of a number of patents and the author of over 250 publications including the sole authorship of several textbooks used worldwide. Her books, columns, and publications have been widely cited in the industry worldwide. As an invited keynote speaker worldwide, she shares her thoughts and vision with various audiences. Her topics range from commencement keynote speech at universities to the emerging technologies at the U.S. Patent and Trademark Office. Over the years, she has taught over 18,000 professionals and researchers in professional advancement courses, focusing on disseminating new technologies and providing the professional advancement education to the workforce. She is a popular keynoter and featured speaker at the national and international events across the US and abroad including Israel, France, Germany, Belgium, Sweden, England, Spain, Mexico, Brazil, Hong Kong, Singapore, Malaysia, Taiwan, Korea, Japan, China, Puerto Rico, Australia, etc.

Being the member of a number of major professional organizations, she has served various leadership capacities including the National President of Surface Mount Technology Association and the board of ASM International. She has served as a reviewer for U.S. government programs and for numerous publications and research institutions.

Outside the industry, Hwang is a prolific writer and speaker on the topics of trade, business, and educational and social agenda. Additionally, Dr. Hwang is a member of the U.S. Commerce Department Export Council and the newly formed National Research Council Globalization Committee. She also serves on the board of Fortune 500 NYSE-traded corporations as well as on civic and university boards.

Hwang received her Ph.D. in Materials Science & Engineering from Case Western Reserve University and two M.S. degrees in Chemistry and Liquid Crystals Science from Columbia University and Kent State's Liquid Crystal Institute.

Having held senior executive positions with Lockheed Martin, SCM Corp., Sherwin Williams Co., IEM Corp., she is currently a partner of H-Technologies Group, Inc., providing business and manufacturing solutions to the electronic industry. Dr. Hwang is also an invited distinguished adjunct professor at the Engineering School of Case Western Reserve University, and serves on the University Board of Trustees. Her books have received a wide circulation throughout the world:

-(ISBN-0-07-143048-2) "Lead-free Implementation: A Guide to Manufacturing" McGraw-Hill, New York, 2005
- (ISBN-0 901 150 401) "Environment-Friendly Electronics--Lead Free Technology", Electrochemical Publications, LTD, Great Britain, 2001
- (ISBN-0-07-031749-3) "Modern Solder Technology for Competitive Electronics Manufacturing", McGraw-Hill, New York, 1996
- (ISBN-0-90-115029-0)"IC Ball Grid Array & Fine Pitch Peripheral Interconnections", Electrochemical Publications, LTD, Great Britain, 1995
- Japanese version, "Solder Paste: Technology and Applications for Surface Mount, Hybrid Circuits, and IC Component Manufacturing", Van Nostrand Reinhold, New York, 1990
- (ISBN-0442-2075-49) "Solder Paste: Technology and Applications for Surface Mount, Hybrid Circuits, and IC Component Manufacturing", Van Nostrand Reinhold, New York, 1988.

To register for the January 9 seminar in Palatine, IL or the January 23 seminar in Hunt Valley, MD, please contact Trace at 847-934-5300 or info@tracelabs.com.