Frontline PCB Solutions, the leading supplier of pre-production CAM and engineering software solutions for the PCB industry, today announced the launch of InCAM™, a dedicated new CAM solution for high density interconnect (HDI) and integrated circuit (IC) packaging production. InCAM™ combines editing and analysis capabilities with automatic design-for-manufacture optimization to perform high-precision CAM tooling, with maximum efficiency and speed--helping manufacturers achieve lasting profitability and a competitive edge.

After intense field-testing and interaction with leading PCB shops, InCAM™ is now available as the first and only CAM system to offer true collaborative processing, enabling operators to co-tool jobs without coming into conflict with other users. Cycle time is significantly shortened as colleagues team up on jobs in a data-secure environment. Operators can multi-task by running advanced processes in the background while they work, using the computer's multi-core CPU capabilities. In addition, backwards compatibility with Genesis 2000, for both data and automation, drives productivity even further.

InCAM™'s smart new design and ergonomic user interface provide the optimum work environment. Features are designed for maximum ease-of-use and minimum training, with related tools conveniently grouped together for easy access. Managers can create a customized CAM Guide to guide operators step by step through the process flow, with direct shortcuts to menu items, checklists and automation tools.

InCAM™ also provides the tools for managing and protecting job data throughout the job cycle, with high data integrity. Check and Fix functionality enables operators to undo and recalculate selected repairs made by global design for manufacture (DfM) operations. Warnings are issued when required at both the input and output stages. Libraries are available to help standardize company practices and reduce errors. The Netlist Compare tool prevents scrap by locating problems and errors.

InCAM™'s sophisticated cleanup tools enable operators to clean up design data with unparalleled accuracy and speed. Cleanup tools include: convert drawn data to contours; recognize teardrop features; SMD and BGA pads; classify embedded and partially embedded pads; and IC packaging design data conversion from contours into pad and trace data to help simplify operations later in the CAM flow.