Dr. Mark Poliks was selected by the New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3IP) and the Southern Tier Opportunity Coalition (STOC) to receive this year's "Technology Leader of the Year" award. The ceremony took place at S3IP's annual dinner on Wednesday, November 11, 2009 at Traditions at the Glen in Johnson City, New York.

The "Technology Leader of the Year" award recognizes significant accomplishments in shaping the technology community through leadership and dedication and enabling economic development in the Southern Tier. Dr. Poliks, Director of Research and Development at EI and Technical Director of the Center for Advanced Microelectronics Manufacturing (CAMM), was honored for his part in the vision and recognition of what the CAMM would become as well as his help obtaining New York state funding for the project.

"Mark is recognized as a leading innovator in the technical community in the area of small-scale systems integration and electronic packaging. He has been instrumental in bringing together partners from government, industry and academia, and facilitating opportunities for collaborations that will advance microelectronics research and development. Through his hard work and dedication, he and his team are developing new electronic applications that will enhance the way people live and interact with their surroundings," commented James J. McNamara, President and CEO at EI. "We are proud of Mark's accomplishments and thank him for his technical leadership that has contributed to the success of both the CAMM and EI," he continued.

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, New York, is a supplier of electronic interconnect solutions consisting of fabrication and assembly of complex printed circuit boards, advance flip chip and wire bond semiconductor packaging, as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, semiconductor, advanced test equipment and medical, where highly reliable products built in robust manufacturing operations are critical for success.

With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information, visit www.endicottinterconnect.com.