Flexible printed circuits serve a wide range of demanding applications. The physical characteristics of flexible circuits, such as lesser thickness, lesser weight and the ability to take any forms, besides reliability and functionality, are driving their use in various innovative end-use applications. Demand for flexible circuits is expected to be robust from end-use markets, such as defense and aerospace, telecommunications, automotive and industrial markets.

GIA announces the release of a comprehensive global report on flexible PCB markets. The world market for flexible PCBs is projected to exceed $16 billion by the year 2015. Rapid technological changes, increasing miniaturization, complexity and portability needs of electronic products in various sectors, such as telecommunications, industrial packaging, medical and automotive, are expected to drive demand for flexible circuits.

Asia-Pacific represents the largest, as well as the fastest, growing market worldwide for flexible PCBs, as stated by the new market research report. Japan is the second largest market for flexible PCBs.

Flexible Printed Circuit Boards: A Global Strategic Business Report  

Communications continues to be the largest end-use market for flexible PCBs worldwide. Demand from the segment is being spurred by growing demand for mobile phones. Increasing global demand for mobile phones in recent years led to substantial demand for flexible circuits. Demand also spawned from the increasing number of flexible circuits per mobile phone unit. However, consumer electronics is expected to emerge as the fastest growing end-use market for flexible printed circuits worldwide.

The global marketplace is characterized by participants such as 3M, Career Technology (MFG.) Co. Ltd., Flexible Circuit Technologies Inc., Fujikura Ltd., Innovex Inc., MFS Technology Ltd., Molex Inc., Multi-Fineline Electronix Inc., Multek Flexible Circuits Inc., Multi-Fineline Electronix Inc., Nippon Mektron Ltd., Nitto Denko Corporation, Northpoint Technologies Inc., Parlex Corporation, Sony Chemical & Information Device Corporation, Si Flex Co. Ltd, Shindo Electric and Sumitomo Bakelite Co. Ltd.

The report, titled Flexible Printed Circuit Boards: A Global Strategic Business Report announced by Global Industry Analysts Inc., provides a comprehensive review of market trends, drivers, product profile, players, competition, recent developments, mergers, acquisitions and other strategic industry activities. Analysis is presented for major geographic markets: the U.S., Canada, Japan, Europe, Asia-Pacific and Rest of World. Global analytics are provided for end-use segments: Automotive, Communication, Computing, Consumer Electronics, Defense & Aerospace, Industrial/Medical and Packaging.

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About Global Industry Analysts, Inc.

Global Industry Analysts, Inc., (GIA) is a reputed publisher of off-the-shelf market research. Founded in 1987, the company is globally recognized as one of the world's largest market research publishers. The company employs over 800 people worldwide and publishes more than 1,100 full-scale research reports each year. Additionally, the company also offers thousands of smaller research products including company reports, market trend reports and industry reports encompassing all major industries worldwide.