Endicott Interconnect Technologies, Inc. (EI) announced today that it has added Direct Optical Registration™, developed by DIS Inc. of Islandia, New York to increase layer-to-layer alignment accuracy for the company's quick-turn PCB business.

Direct Optical Registration™ allows for optical alignment of inner layers during the lay-up process of multi-layers and sequential build-up technology, eliminating the need to manually punch and pin individual layers prior to lamination. Tolerance buildup and variability associated with traditional pin lamination systems is eliminated.

A vision and positioning system sequentially align and clamp layers together utilizing a full platen, assuring coplanarity and accuracy. The aligned multi-layers are welded together with SmartWeld™, the patented coupled induction welding system developed by DIS Inc.

Direct Optical Registration™ provides an opportunity to utilize X-ray inspection to quantify registration of welded mulit-layers prior to lamination. The panel can then be measured after lamination, providing the data to analyze the lamination process and take corrective actions if necessary.

"Direct Optical Registration™ has drastically reduced our cycle times by removing the manual lay-up process and eliminating tolerance variations from tooling hole size, lamination plate bushing locations and pin sizes," stated Jeff Knight, Director of Quick Turn Fabrication at EI. "Additionally, the system optically aligned a 52 layer PCB, demonstrating its versatility."

About DIS Inc.

DIS Inc. is a worldwide leader in optical registration systems for the PCB industry and an innovative producer of innerlayer/sub-lam registration and welding equipment. DIS has developed Direct Optical Registration™, a new method of optically registering and welding innerlayers/sub-lam such that registration is improved by eliminating mechanical tooling, operational cycle times are reduced and process flexibility is increased all while significantly reducing operating costs. For more information, visit www.distechnology.com.

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, New York, is a vertically-integrated provider of high-performance electronic packaging solutions consisting of design and fabrication of PCBs and advanced semiconductor packaging, full turnkey services for PCB and integrated circuits assembly and test, as well as systems integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, advanced test equipment and medical, where highly reliable products built in robust manufacturing operations are critical for success.

With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information, visit www.endicottinterconnect.com.