The current incarnation of the silicon substrate is a simplified version of the full 3-D-TSV being developed by many companies. Substrates can be produced with TSVs and are an appealing interim step to some companies because they offer fewer challenges than vias through active silicon.

For this study, TechSearch International interviewed IDMs, OSATs and substrate suppliers. Several companies are investigating silicon interposers and there is great interest in the topic, but there is no clear consensus on applications and timing for adoption. 

This report details the potential applications for silicon interposers, as well as current and future suppliers. Interposer dimensions are provided, including interposer thickness, via diameter and via pitch. A market forecast for silicon interposers is provided. This analysis is a part of TechSearch's Advanced Packaging Update Service. For additional information see the data sheet (Advanced Packaging Update: Vol. 1-010) at http://www.techsearchinc.com/index.html.

About TechSearch International

TechSearch International, Inc., founded in 1987, is market research firm specializing in technology trends microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning and market and technology analysis. Research topics include flip chip interconnects and wafer level packaging, CSPs, BGAs, high-density flex circuits, microvia substrates and system-in-packages (SiP), and lead-free and environmentally friendly manufacturing. TechSearch International professionals have an extensive network of more than 15,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887, fax: 512-372-8889, or www.techsearchinc.com.