Advantech US has introduced a printing technology for the microelectronic industry to additively manufacture electronic sensors, devices, and circuits for fine features down to 5 µm in size. Like building blocks, this additive process deposits bulk materials, like metals, layer-by-layer to build components such as capacitors, resistors, and transistors.
Features and devices below 5 µm are typically the realm of Chips/VLSI. Features above 30 µm are the realm of traditional printed circuit and device technologies. The manufacturing processes of these two worlds have rarely intersected. Advantech US has developed a printing process that allows these worlds to merge.
The Advantech US process uses precision shadow masks combined with sub-micrometer registration with thermal, e-beam, and sputter deposition techniques to additively print sensors, circuits, and devices on a variety of rigid and flexible substrates. This additive process reduces the complex etching processes, waste disposal and capital costs associated with photolithography. Finally, the use of bulk materials, not inks, takes full advantage of proven material properties and performance.
Figure 1: Advantech US pinting process.
The Advantech US process provides a green, efficient, cost-effective, in-line process in a small footprint.
This enabling technology lessens design and manufacturing complexity by reducing process steps and material handling. It provides the ability to generate features and devices to 5 µm on both rigid and flexible substrates.