Reliability & Improved Quality

There have been no observations that solder joints produced using MS2 are of lower quality or reliability In fact, there were initial lab observations that solder joints produced using MS2 are of higher quality. There is now statistically valid data available that shows MS2 contributes to improved quality.

“The conclusion that can be drawn is that the samples with MS2 have hole fill that is as good or better than without MS2”
Kola Akinade PhD, Cisco/Scientific Atlanta

Reliability

Significant reliability testing has been undertaken at various 3rd party test and reliability facilities such as Engent Labs, Foresite, STI, and the University of Toronto as well as at beta and initial production sites There have been no issues with reliability or contamination. All tests conducted to date for SIR electrical performance and ion chromatography testing have passed with levels well above the limits of 1E8 ohms of resistance which is the SIR criteria of J-STD-001C No change in grain structure has been found between the boards processed with and without MS2™