Oak Mitsui and Ohmega Technologies have been working with embedded materials for quite some time. Oak, with an embedded capacitance material, and Ohmega, with its 30-year history of embedding resistors, both heard cries from customers for one material that could handle both needs. From both a technological standpoint — fewer complex layers to manufacture — and a cost perspective, such a material might make embedded materials a more common HDI design choice.
In a nutshell, the invention concerns multilayered constructions and is useful for forming resistors and capacitors inside printed circuit boards and microelectronic devices. The multilayered constructions are sequentially attached layers comprising: a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer, and a nickel-phosphorus electrical resistance material layer electroplated onto a second electrically conductive layer.
Though not even granted a patent number yet, the inventors joined me in a conference call to discuss what they're trying to accomplish by developing this new material. Oak Mitsui Vice President of Strategic Technologies and Vice President of Ohmega Technologies Bruce Mahler were clear: they expect this patent to help embedded materials finally realize their potential in the marketplace.
While your listening to this streaming audio interview, feel free to download a presentation and paper first presented at a recent IPC conference.
