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	<title>The Next Stage of Assembly: 3-D and Solder-Free</title>
	<description>Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!
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	<link>http://www.pcb007.com/pages/zone.cgi?a=69967</link>
	<pubDate>Sun, 25 Jul 2010 12:46:00 GMT</pubDate>
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