http://www.pcb007.com/ PCB fabricator news from around the world: PCB007 Demands for higher performance, multifunctionality and size reduction require package substrates to offer improved high-speed signal transmission, higher wiring density and high system reliability. An SAP is widely used with build-up dielectric materials to form the circuit features. Features of such metallization processes are detailed here. http://www.pcb007.com/pages/zone.cgi?a=59445 Tue, 13 Jul 2010 12:56:00 GMT