http://www.pcb007.com/ PCB fabricator news from around the world: PCB007 When electroless copper is deposited on the polyimide substrates used for flex and rigid-flex circuits, adhesion must not be compromised. The goal is to minimize stress (both compressive and tensile) to the best extent possible. The first critical factor is the control of the copper deposition rate. http://www.pcb007.com/pages/zone.cgi?a=69884 Thu, 05 Aug 2010 10:21:00 GMT