<?xml version="1.0"?>
<rss version="2.0">
<channel>
<title>PCB007 - Environmental</title>
<link>http://www.pcb007.com/</link>
<description>PCB fabricator news from around the world: PCB007 - Environmental</description>
<item>
	<title>GAO Highlights Challenges in Proper Handling of Obsolete Electronics</title>
	<description>Low recycling rates for used TVs, PCs, and other electronics result in the loss of valuable resources, and electronic waste exports risk harming human health and the environment in countries that lack safe recycling and disposal capacity.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70556</link>
	<pubDate>Fri, 13 Aug 2010 14:55:00 GMT</pubDate>
</item>
<item>
	<title>Evaluation of Halogen-Free Laminates Used in Handheld Electronics</title>
	<description>This paper examines the thermal properties of various halogen-free laminates used in handheld electronic products and correlates these properties with manufacturing requirements. Thermal properties investigated include z-axis CTE, time to delamination at 260&#176;C and 288&#176;C and temperature to decomposition. </description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70439</link>
	<pubDate>Tue, 10 Aug 2010 12:06:00 GMT</pubDate>
</item>
<item>
	<title>China Green Policies Spur Local Wind Energy, PV Markets</title>
	<description>Chinese government policies intended to promote the adoption of green technologies are having the desired effect, with the country enjoying a boom in wind power capacity and PV installations that is fueling the establishment of a new generation of global green energy suppliers.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70349</link>
	<pubDate>Thu, 05 Aug 2010 13:27:00 GMT</pubDate>
</item>
<item>
	<title>IPC Executive Conference Addresses Critical Issues</title>
	<description>To help executives understand new industry paradigms and manage change, industry leaders and experts will come together at the Electronics Industry Executive Summit: Ideas for a Bright Future in the New Electronics Industry, October 13-14, 2010,</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70278</link>
	<pubDate>Wed, 04 Aug 2010 11:56:00 GMT</pubDate>
</item>
<item>
	<title>Emerging Market Opportunities Fuel Interest in SEMICON Taiwan</title>
	<description>Driven by strong IC market expansion and growth in emerging markets, SEMICON Taiwan 2010 returns to the Taipei World Trade Center September 8-10, 2010 with eight technology theme pavilions focusing on LEDs, MEMS, 3-D ICs and Advanced Packaging/Testing, Green Management, Compound Semiconductors, CMP, AOI and the Secondary Market for capital equipment. </description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70243</link>
	<pubDate>Mon, 02 Aug 2010 16:32:00 GMT</pubDate>
</item>
<item>
	<title>The Next Stage of Assembly: 3-D and Solder-Free</title>
	<description>Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!
</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69967</link>
	<pubDate>Sun, 25 Jul 2010 12:46:00 GMT</pubDate>
</item>
<item>
	<title>Updates on iNEMI's Key Environmental Projects</title>
	<description>iNEMI releases brief updates on its key environmental projects: Studies on Halogenated Flame Retardant Alternatives, Eco-Impact Evaluator Project, PVC Alternatives for Desktop Power Cords, 2011 ECE Roadmap and iNEMI's Future Environmental Priorities.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69945</link>
	<pubDate>Wed, 21 Jul 2010 09:32:00 GMT</pubDate>
</item>
<item>
	<title>Rockwell Collins to Take Part in AIRE &quot;Green Connection&quot; </title>
	<description>Rockwell Collins, as member of a consortium of industry partners led by the Swedish Air Navigation Service Provider &quot;Luftfartsverket&quot; (LFV), has been awarded an active role in the AIRE &quot;Green Connections&quot; project.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69907</link>
	<pubDate>Tue, 20 Jul 2010 13:58:00 GMT</pubDate>
</item>
<item>
	<title>IPC, IPCA Comment on India's Proposed E-Waste Rules</title>
	<description>Working together to address the latest round of proposed substance restrictions, IPC and the IPCA have submitted comments in response to the Indian Government's Ministry of Environment and Forests draft notification of E-waste (Management and Handling) Rules 2010.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69608</link>
	<pubDate>Fri, 09 Jul 2010 13:30:00 GMT</pubDate>
</item>
<item>
	<title>IPC Summit to Discuss Ideas for New Electronics Industry</title>
	<description>The IPC's Electronics Industry Executive Summit will cover the latest trends in markets, technologies and management issues that will help executives change with the industry.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69586</link>
	<pubDate>Thu, 08 Jul 2010 13:09:00 GMT</pubDate>
</item>
<item>
	<title>Toughened Laminates for PCBs: Correlation of Drillability to Material Properties</title>
	<description>In this paper, the authors report results from a study on incorporating pre-formed toughening materials into high-crosslink density phenolic cured resin formulations and the effect of the toughener on thermomechanical properties, toughness and drillability of the electrical laminates.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69496</link>
	<pubDate>Thu, 08 Jul 2010 12:35:00 GMT</pubDate>
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</channel>
</rss>
