http://www.pcb007.com/ PCB fabricator news from around the world: PCB007 - Advanced Packaging Die thickness of common, high-volume chip stacks range from 50 to 100 um while thinning industry aims for ultra-thin chips of 10 um thickness, or less. For the first time, the required interconnect length between vertically arranged adjacent chip layers has reached dimensions that can be reasonably realized by anisotropic conductive adhesives layers (ACA). http://www.pcb007.com/pages/zone.cgi?a=70563 Tue, 24 Aug 2010 12:59:00 GMT The reviews are in--and we're not talking about the latest summer blockbuster. Just one month after acquiring SMT Magazine, I-Connect007 published its first issue of the magazine. The feedback from loyal SMT readers has been overwhelmingly positive. SMT Magazine is just one example of what we have planned for the future. http://www.pcb007.com/pages/zone.cgi?a=70758 Mon, 23 Aug 2010 15:02:00 GMT DKN Research is now offering a Fine Silver Conductor Trial Kit capable of producing fine lines down to 50 microns to companies interested in producing high density thick film circuits. http://www.pcb007.com/pages/zone.cgi?a=70452 Tue, 10 Aug 2010 12:26:00 GMT Driven by strong IC market expansion and growth in emerging markets, SEMICON Taiwan 2010 returns to the Taipei World Trade Center September 8-10, 2010 with eight technology theme pavilions focusing on LEDs, MEMS, 3-D ICs and Advanced Packaging/Testing, Green Management, Compound Semiconductors, CMP, AOI and the Secondary Market for capital equipment. http://www.pcb007.com/pages/zone.cgi?a=70243 Mon, 02 Aug 2010 16:32:00 GMT University of Illinois engineers have developed a novel direct-writing method for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics. http://www.pcb007.com/pages/zone.cgi?a=69874 Mon, 19 Jul 2010 16:25:00 GMT Demands for higher performance, multifunctionality and size reduction require package substrates to offer improved high-speed signal transmission, higher wiring density and high system reliability. An SAP is widely used with build-up dielectric materials to form the circuit features. Features of such metallization processes are detailed here. http://www.pcb007.com/pages/zone.cgi?a=59445 Tue, 13 Jul 2010 12:56:00 GMT EV Group has launched the EVG560HBL wafer bonder -- the industry's first fully automated wafer bonding system for high-brightness light emitting diode (HB-LED) manufacturing. http://www.pcb007.com/pages/zone.cgi?a=69703 Mon, 12 Jul 2010 15:24:00 GMT With the Applied Producer Avila system, Applied Materials becomes the first equipment supplier to offer comprehensive TSV solutions for speeding the development and time to market of 3D-ICs. http://www.pcb007.com/pages/zone.cgi?a=69695 Mon, 12 Jul 2010 14:48:00 GMT Alchimer S.A., a provider of nanometric deposition technology for through-silicon vias (TSV), semiconductor interconnects, and other electronic applications, announced today that Panasonic Corporation has become an equity investor in the company. http://www.pcb007.com/pages/zone.cgi?a=69680 Mon, 12 Jul 2010 13:44:00 GMT