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<title>PCB007 - Associations</title>
<link>http://www.pcb007.com/</link>
<description>PCB fabricator news from around the world: PCB007 - Associations</description>
<item>
	<title>EIPC Speednews: News from the European PCB Market</title>
	<description>EIPC extends an invitation to researchers, academics, technical experts and industry leaders around the world to submit abstracts for the 12th Electronic Circuits World Convention taking place November 9-11, 2011, at the Taipei Nangang Exhibition Centre, Taiwan.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70957</link>
	<pubDate>Tue, 31 Aug 2010 14:58:00 GMT</pubDate>
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	<title>EIPC Workshop to Focus on Rigid/Rigid-Flex PCBs</title>
	<description>The workshop aims to discuss new design options for improved technologies, new basic materials for higher reliability, new components and component types for miniaturization and future developments and trends in the rigid and rigid-flex PCB industry.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70915</link>
	<pubDate>Mon, 30 Aug 2010 14:28:00 GMT</pubDate>
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<item>
	<title>IPC: PCB Industry Results for July 2010</title>
	<description>IPC has announced the July findings from its monthly North American PCB Statistical Program. Rigid PCB shipments were up 23.9% while bookings increased 34.4% in July 2010 from July 2009. Flexible circuit shipments in July 2010 were up 38.2%, and bookings were up 28.8% compared to July 2009. 

</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70883</link>
	<pubDate>Mon, 30 Aug 2010 12:02:00 GMT</pubDate>
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	<title>The Shaughnessy Report: HDI Class Q&amp;A with Dan Smith</title>
	<description>Is North America falling behind the rest of the world in HDI technology development? Not if Dan Smith can help it. &quot;The New Mr. HDI&quot; is putting together the first IPC HDI certification course and exam. We caught up with him and discussed the HDI course, what it takes to be an instructor and Happy Holden's 400-gig &quot;data dump.&quot;</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70801</link>
	<pubDate>Thu, 26 Aug 2010 12:42:00 GMT</pubDate>
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	<title>IPC: Call for Participation at ECWC12</title>
	<description>IPC is inviting researchers, academics, technical experts and industry leaders worldwide to submit abstracts for the 12th Electronic Circuits World Convention taking place November 9-11, 2011, in conjunction with TPCA Show 2011, in Taiwan.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70838</link>
	<pubDate>Thu, 26 Aug 2010 12:22:00 GMT</pubDate>
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<item>
	<title>RFID Consortium Adds ETRI</title>
	<description>Sisvel US and the RFID Consortium today announced that ETRI has joined the RFID Consortium and will participate in the Consortium's joint licensing program for patents essential to the UHF RFID standard. </description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70786</link>
	<pubDate>Tue, 24 Aug 2010 14:14:00 GMT</pubDate>
</item>
<item>
	<title>EIPC Speednews: News from the European PCB Market</title>
	<description>PCBs sales in Germany slid in May, according to data from ZVEI PCB and Electronic Systems, but were still a 40% improvement from May of last year. Cumulatively, sales for the first five months of this year were up 32% and incoming orders also reached record highs in May, jumping 137% year-on-year. </description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70771</link>
	<pubDate>Tue, 24 Aug 2010 11:26:00 GMT</pubDate>
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	<title>IPC-7351B Updates Components Mounting Requirements</title>
	<description>IPC has just released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. IPC-7351B gives designers and board makers updated information on the diverse requirements of land pattern geometries for active and passive components designed for surface mounting.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70642</link>
	<pubDate>Wed, 18 Aug 2010 12:05:00 GMT</pubDate>
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<item>
	<title>EIPC Speednews: News from the European PCB Market</title>
	<description>Printed electronics offers a wide range of opportunities that cannot be realised using conventional electronics manufacturing approaches and, as a result, there is a rapidly expanding global effort to both develop the technology and to bring to market new products covering a wide range of novel applications.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70615</link>
	<pubDate>Tue, 17 Aug 2010 12:44:00 GMT</pubDate>
</item>
<item>
	<title>New Electronic IEEE Membership Option Reduces Cost of Joining</title>
	<description>IEEE, the world&#8217;s largest association for engineering and technical professionals, will begin offering a new electronic membership (e-Membership) option to individuals in developing nations, when its 2011 membership year begins on 16 August. </description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70607</link>
	<pubDate>Tue, 17 Aug 2010 10:46:00 GMT</pubDate>
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<item>
	<title>SEMI Announces Reorganization</title>
	<description>Jonathan Davis becomes president, Semiconductor IC Business Unit; Karen Savala assumes role of president, SEMI Americas</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70585</link>
	<pubDate>Mon, 16 Aug 2010 13:16:00 GMT</pubDate>
</item>
<item>
	<title>IPC Webinar Highlights Reduction of Layer Counts</title>
	<description>BGAs are becoming more dense, making it more difficult for board designers to route traces to the center of the array. One of the easiest solutions is to add layers, but that flies in the face of today's push to trim the complexity and cost of hardware.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70486</link>
	<pubDate>Wed, 11 Aug 2010 13:20:00 GMT</pubDate>
</item>
<item>
	<title>HDP User Group Initiates Optoelectronics Project</title>
	<description>The High Density Packaging User Group International, Inc. (HDP User Group), a global non-profit cooperative research and development organization for the Electronics Manufacturing industries, announces the start of a new project group focusing on optical electronics.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70409</link>
	<pubDate>Mon, 09 Aug 2010 13:11:00 GMT</pubDate>
</item>
<item>
	<title>Video: Beating The Heat </title>
	<description>Guest Editors Mark Thompson and Kelly Dack discuss techniques and materials for improving heat dissipation on PCBs, as well as the challenges designers face in trying to accurately calculate heat dissipation. </description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70310</link>
	<pubDate>Mon, 09 Aug 2010 12:54:00 GMT</pubDate>
</item>
<item>
	<title>Guidelines Set on Conflict Minerals Regulation</title>
	<description>A new bill, the Financial Reform Bill (HR 4173), has been recently signed, wherein Sec. 1502 states that manufacturers are required to report annually to the SEC if their products contain &quot;conflict minerals&quot; from the Democratic Republic of Congo.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70356</link>
	<pubDate>Thu, 05 Aug 2010 14:13:00 GMT</pubDate>
</item>
<item>
	<title>EIPC Speednews: News from the European PCB Market</title>
	<description>Based on recent surveys, PCB solder finishes are one of the most common cause of
soldering defects and rejection of PCBs during assembly. Design and Process Engineers highlighted solder finishes 35%, with delamination at 25%, third place were cosmetic faults.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70357</link>
	<pubDate>Thu, 05 Aug 2010 12:17:00 GMT</pubDate>
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<item>
	<title>Analyzing Moisture's Impact on PCBs</title>
	<description>As frequencies get faster and designs get more complex, the electrical and thermal properties of PCBs are becoming a more critical factor in system designs. Many board developers don't realize that moisture in boards can significantly alter their performance.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70275</link>
	<pubDate>Wed, 04 Aug 2010 13:32:00 GMT</pubDate>
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<item>
	<title>IPC Executive Conference Addresses Critical Issues</title>
	<description>To help executives understand new industry paradigms and manage change, industry leaders and experts will come together at the Electronics Industry Executive Summit: Ideas for a Bright Future in the New Electronics Industry, October 13-14, 2010,</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70278</link>
	<pubDate>Wed, 04 Aug 2010 11:56:00 GMT</pubDate>
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<item>
	<title>Reliability and Sustainability Focus of IPC Conference</title>
	<description>Bringing together the latest research by industry experts, IPC will host a Technical Conference on Electronics Sustainability, September 28-30, 2010 at Electronics Midwest, in Rosemont, Illinois. Electronics Midwest is produced jointly by IPC and Canon Communications.

</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70246</link>
	<pubDate>Tue, 03 Aug 2010 12:50:00 GMT</pubDate>
</item>
<item>
	<title>LED Market to Reach US$20.4 Billion by 2012</title>
	<description>Research and Markets: Global and China Led Industry Report 2010 Reveals the LED Market Will Reach US$20.4 Billion in 2012 </description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70177</link>
	<pubDate>Fri, 30 Jul 2010 12:03:00 GMT</pubDate>
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<item>
	<title>Maintaining Signal Integrity</title>
	<description>At frequencies over 200 MHz, board designers must pay particular attention to signal integrity issues. &quot;Signal integrity is all about the white space on the schematic. You can see the chips, packaging, wiring and the other components. Signal integrity is all about the spaces between those components,&quot; said Eric Bogatin. </description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70098</link>
	<pubDate>Thu, 29 Jul 2010 09:43:00 GMT</pubDate>
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<item>
	<title>EIPC Speednews: News from the European PCB Market</title>
	<description>Graphic plc, the leading UK-based specialist PCB electronics interconnect manufacturer with 42 years in the business, adds NADCAP to its supreme portfolio of manufacturing approvals.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70085</link>
	<pubDate>Tue, 27 Jul 2010 13:10:00 GMT</pubDate>
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<item>
	<title>IPC Military Conference Highlights EMS Opportunities</title>
	<description>The conference will offer essential, up-to-date information from noted experts to help EMS companies understand what the military needs from them, the important steps they need to take to comply with government restrictions and how to obtain proper certifications to become an in-demand supplier.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70074</link>
	<pubDate>Tue, 27 Jul 2010 12:57:00 GMT</pubDate>
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	<title>iNEMI Workshop to Focus on Medical Electronics Packaging Technologies </title>
	<description>The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium, is sponsoring a workshop on the technical and regulatory challenges anticipated in the implantable and portable segments of the medical electronics industry.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=70029</link>
	<pubDate>Mon, 26 Jul 2010 07:33:00 GMT</pubDate>
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<item>
	<title>IPC Revises SMT Design and Land Pattern Standard</title>
	<description>The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69973</link>
	<pubDate>Fri, 23 Jul 2010 09:17:00 GMT</pubDate>
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	<title>Updates on iNEMI's Key Environmental Projects</title>
	<description>iNEMI releases brief updates on its key environmental projects: Studies on Halogenated Flame Retardant Alternatives, Eco-Impact Evaluator Project, PVC Alternatives for Desktop Power Cords, 2011 ECE Roadmap and iNEMI's Future Environmental Priorities.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69945</link>
	<pubDate>Wed, 21 Jul 2010 09:32:00 GMT</pubDate>
</item>
<item>
	<title>SIA Names Brian Toohey President</title>
	<description>Brian C. Toohey took office today as President of the Semiconductor Industry Association (SIA). Toohey succeeds George Scalise, who has led the association since 1997. SIA is the voice of the U.S. semiconductor industry, America's number-one export industry over the past five years.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69855</link>
	<pubDate>Mon, 19 Jul 2010 12:20:00 GMT</pubDate>
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	<title>EIPC Speednews: News from the European PCB Market</title>
	<description>This year's European Electronics Assembly Reliability Summit, to be held September 21-23 in Tallinn, Estonia, will provide a unique opportunity
to examine, learn and debate business-critical reliability, traceability
and yield enhancement issues.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69866</link>
	<pubDate>Mon, 19 Jul 2010 12:06:00 GMT</pubDate>
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	<title>EIPC Speednews: News from the European PCB Market</title>
	<description>The fifth SMART SYSTEMS INTEGRATION (SSI), European Conference &amp; Exhibition on
integration issues of miniaturised systems &#8211; MEMS, MOEMS, ICs and electronic
components, takes place in 2011 from 22 - 23 March in Dresden, Germany.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69699</link>
	<pubDate>Mon, 12 Jul 2010 15:03:00 GMT</pubDate>
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	<title>Electronics Midwest to Focus on Tech Conferences, Workshops</title>
	<description>IPC and Canon Communications have joined forces to produce Electronics Midwest, an exhibition and technical conference for the assembly and PCB design and manufacturing industries. Providing business and technology solutions that save time, energy and money, the event will bring the best of the global electronics industry together, September 28-30, 2010.
</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69641</link>
	<pubDate>Mon, 12 Jul 2010 13:30:00 GMT</pubDate>
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<item>
	<title>IPC, IPCA Comment on India's Proposed E-Waste Rules</title>
	<description>Working together to address the latest round of proposed substance restrictions, IPC and the IPCA have submitted comments in response to the Indian Government's Ministry of Environment and Forests draft notification of E-waste (Management and Handling) Rules 2010.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69608</link>
	<pubDate>Fri, 09 Jul 2010 13:30:00 GMT</pubDate>
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	<title>IPC Asks for Technical Papers, Course Proposals</title>
	<description>IPC is inviting the industry to submit a course proposal for IPC APEX EXPO 2011's upcoming Technical Conference and Professional Development Courses, which will be held at the Mandalay Bay Resort and Convention Center in Las Vegas, Nevada.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69592</link>
	<pubDate>Thu, 08 Jul 2010 13:55:00 GMT</pubDate>
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	<title>IPC Summit to Discuss Ideas for New Electronics Industry</title>
	<description>The IPC's Electronics Industry Executive Summit will cover the latest trends in markets, technologies and management issues that will help executives change with the industry.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69586</link>
	<pubDate>Thu, 08 Jul 2010 13:09:00 GMT</pubDate>
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	<title>HKPCA &amp; IPC Show: Inspiration, Integration, Progression</title>
	<description>2010 International Printed Circuit &amp; Electronics Assembly Fair Helps Industry Seize Opportunities Arising from Renewed Growth</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69540</link>
	<pubDate>Wed, 07 Jul 2010 11:03:00 GMT</pubDate>
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	<title>NAM Releases Comprehensive Strategy for U.S. Competitiveness</title>
	<description>Manufacturers Release Comprehensive Strategy for Global Competitiveness Plan Outlines What is Needed to Create Jobs, Boost the Economy and Put the Country on a Course for Growth</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69528</link>
	<pubDate>Tue, 06 Jul 2010 15:16:00 GMT</pubDate>
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	<title>SEMI Announces CSTIC 2011 Call for Papers</title>
	<description>SEMI today announced that abstracts for paper presentations are now being accepted for the CSTIC 2011 exhibition, which will be held March 13-14 in Shanghai, China, in conjunction with SEMICON China 2011. </description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69512</link>
	<pubDate>Tue, 06 Jul 2010 12:13:00 GMT</pubDate>
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	<title>SEMI Announces Eight New Technical Standards</title>
	<description>SEMI has published eight new technical standards applicable to the semiconductor, MEMS, FPD and photovoltaic (PV) manufacturing industry.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69483</link>
	<pubDate>Mon, 05 Jul 2010 12:58:00 GMT</pubDate>
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<item>
	<title>EIPC Speednews: News from the European PCB Market</title>
	<description>IDTechEx announces Europe's largest annual event, Printed Electronics, will take place in D&#252;sseldorf, Germany, April 5-6, 2011. The event, attended by more than 900 attendees in 2010 in Dresden, will feature more than 100 exhibitors and provides a platform for potential users of the technology to meet with suppliers.</description>
	<link>http://www.pcb007.com/pages/zone.cgi?a=69490</link>
	<pubDate>Mon, 05 Jul 2010 12:51:00 GMT</pubDate>
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