http://www.pcb007.com/ PCB fabricator news from around the world: PCB007 - RoHS / Lead-Free Enthone's research has focused on providing a solderable surface finish for PCBs containing organic nanometal. The first universal nanofinish was proposed four years ago. Now, the new-generation nanofinish with organic metal-Ag complex performs as well as any other surface finish with regard to aging resistance, discoloration and solderability. http://www.pcb007.com/pages/zone.cgi?a=70948 Tue, 31 Aug 2010 13:58:00 GMT Authors from Sandia National Laboratories investigate the solderability of current immersion Ag technology after exposure to conditions that simulate long-term storage followed by bake out environments prior to actual reflow assembly. http://www.pcb007.com/pages/zone.cgi?a=55937 Wed, 25 Aug 2010 13:20:00 GMT Rogers Corporation will be highlighting the benefits of its new 6.15 dielectric constant RO4360 laminate and RO4460 prepreg system at the upcoming Electronics Midwest 2010 exhibition. http://www.pcb007.com/pages/zone.cgi?a=70802 Wed, 25 Aug 2010 10:17:00 GMT Rogers Corporation will be featuring its latest addition to the high-speed digital market at this year's PCB West 2010 Exhibition at the Santa Clara Convention Center, September 29, 2010. http://www.pcb007.com/pages/zone.cgi?a=70604 Tue, 17 Aug 2010 07:46:00 GMT An expected recast of the RoHS (restriction of hazardous substances) environmental directive will likely carve away exclusions and possibly add new substances to the current list of six banned substances. http://www.pcb007.com/pages/zone.cgi?a=70512 Thu, 12 Aug 2010 11:20:00 GMT This paper examines the thermal properties of various halogen-free laminates used in handheld electronic products and correlates these properties with manufacturing requirements. Thermal properties investigated include z-axis CTE, time to delamination at 260°C and 288°C and temperature to decomposition. http://www.pcb007.com/pages/zone.cgi?a=70439 Tue, 10 Aug 2010 12:06:00 GMT Based on recent surveys, PCB solder finishes are one of the most common cause of soldering defects and rejection of PCBs during assembly. Engineers highlighted solder finishes 35%, with delamination at 25%, third place were cosmetic faults. http://www.pcb007.com/pages/zone.cgi?a=70232 Mon, 02 Aug 2010 09:10:00 GMT Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world! http://www.pcb007.com/pages/zone.cgi?a=69967 Sun, 25 Jul 2010 12:46:00 GMT With proper planning, stiffeners can be designed to aid assembly through the designed manufacture of a flex circuit that can be handled as if it were a rigid circuit board. Such constructions can be accomplished by using any one of several methods. http://www.pcb007.com/pages/zone.cgi?a=69814 Wed, 21 Jul 2010 12:37:00 GMT Materials are the most purchased items in the PCB industry for both business and technology customers. Material suppliers occupied the majority of the space at the show; however, many suppliers considered to be large players in the industry were absent. Why did they pass on this year's show? http://www.pcb007.com/pages/zone.cgi?a=69842 Mon, 19 Jul 2010 14:07:00 GMT Corner cracks are observed less often than barrel cracks, but with high-rel boards, we can't be too careful. Unlike barrel cracks, which can fail catastrophically, knee cracks tend to propagate over time. The damaged pad actually resembles a funnel and the warp and weft of the glass give the funnel an uneven, puckered shape. http://www.pcb007.com/pages/zone.cgi?a=69569 Sat, 10 Jul 2010 12:07:00 GMT Working together to address the latest round of proposed substance restrictions, IPC and the IPCA have submitted comments in response to the Indian Government's Ministry of Environment and Forests draft notification of E-waste (Management and Handling) Rules 2010. http://www.pcb007.com/pages/zone.cgi?a=69608 Fri, 09 Jul 2010 13:30:00 GMT In this paper, the authors report results from a study on incorporating pre-formed toughening materials into high-crosslink density phenolic cured resin formulations and the effect of the toughener on thermomechanical properties, toughness and drillability of the electrical laminates. http://www.pcb007.com/pages/zone.cgi?a=69496 Thu, 08 Jul 2010 12:35:00 GMT The effect of post-reflow cleaning processes on creep corrosion are discussed in this paper from Alcatel-Lucent.The authors examine a laboratory MFG test that replicates field creep corrosion. Comparisons of creep corrosion susceptibility between OSP and ImAg PWB surface finishes are also made. http://www.pcb007.com/pages/zone.cgi?a=59954 Tue, 06 Jul 2010 12:44:00 GMT